The Department of Defense is offering the Common Heterogeneous Integration and IP Reuse Strategies (CHIPS) grant to develop design tools and integration standards for modular integrated circuit designs. This grant aims to leverage the strengths of both DoD and commercial technologies. Amendments include updates to proposal due dates and formatting guidelines. Applicants can refer to the DARPA-BAA-16-62 document for detailed information.
Opportunity ID: 289238
General Information
| Document Type: | Grants Notice |
| Funding Opportunity Number: | DARPA-BAA-16-62 |
| Funding Opportunity Title: | Common Heterogeneous Integration and IP Reuse Strategies (CHIPS) |
| Opportunity Category: | Discretionary |
| Opportunity Category Explanation: | – |
| Funding Instrument Type: | Cooperative Agreement Grant Other Procurement Contract |
| Category of Funding Activity: | Science and Technology and other Research and Development |
| Category Explanation: | – |
| Expected Number of Awards: | – |
| Assistance Listings: | 12.910 — Research and Technology Development |
| Cost Sharing or Matching Requirement: | No |
| Version: | Synopsis 4 |
| Posted Date: | Sep 29, 2016 |
| Last Updated Date: | Dec 21, 2016 |
| Original Closing Date for Applications: | Dec 16, 2016 |
| Current Closing Date for Applications: | Jan 13, 2017 |
| Archive Date: | Jul 13, 2017 |
| Estimated Total Program Funding: | – |
| Award Ceiling: | – |
| Award Floor: | – |
Eligibility
| Eligible Applicants: | Unrestricted (i.e., open to any type of entity above), subject to any clarification in text field entitled “Additional Information on Eligibility” |
| Additional Information on Eligibility: | – |
Additional Information
| Agency Name: | DARPA – Microsystems Technology Office |
| Description: | Amendment 02: The purpose of this amendment is to add a header to the Full Proposal Format section. See the changes as highlighted in yellow in the attached conformed DARPA-BAA-16-62 document.
Amendment 01: The purpose of this amendment is to update the Proposal Due Date and FAQ Deadline. See the changes as highlighted in yellow in the attached DARPA-BAA-16-62 document.Original Synopsis Below.The Common Heterogeneous Integration and Intellectual Property (IP) Reuse Strategies (CHIPS) program will develop the design tools and integration standards required to demonstrate modular integrated circuit (IC) designs that leverage the best of DoD and commercial designs and technology.See the attached DARPA-BAA-16-62 document. |
| Link to Additional Information: | DARPA Solicitations Page |
| Grantor Contact Information: | If you have difficulty accessing the full announcement electronically, please contact:
Dr. Daniel Green
MTO Program Manager Email:DARPA-BAA-16-62@darpa.mil |
Version History
| Version | Modification Description | Updated Date |
|---|---|---|
| Amendment 02: The purpose of this amendment is to add a header to the Full Proposal Format section. See the changes as highlighted in yellow in the attached conformed DARPA-BAA-16-62 document. | Dec 21, 2016 | |
| Amendment 02: The purpose of this amendment is to add a header to the Full Proposal Format section. See the changes as highlighted in yellow in the attached conformed DARPA-BAA-16-62 document. | Dec 21, 2016 | |
| Amendment 01: The purpose of this amendment is to update the Proposal Due Date and FAQ Deadline. See the changes as highlighted in yellow in the attached DARPA-BAA-16-62 document. | Dec 21, 2016 | |
| Nov 22, 2016 |
DISPLAYING: Synopsis 4
General Information
| Document Type: | Grants Notice |
| Funding Opportunity Number: | DARPA-BAA-16-62 |
| Funding Opportunity Title: | Common Heterogeneous Integration and IP Reuse Strategies (CHIPS) |
| Opportunity Category: | Discretionary |
| Opportunity Category Explanation: | – |
| Funding Instrument Type: | Cooperative Agreement Grant Other Procurement Contract |
| Category of Funding Activity: | Science and Technology and other Research and Development |
| Category Explanation: | – |
| Expected Number of Awards: | – |
| Assistance Listings: | 12.910 — Research and Technology Development |
| Cost Sharing or Matching Requirement: | No |
| Version: | Synopsis 4 |
| Posted Date: | Sep 29, 2016 |
| Last Updated Date: | Dec 21, 2016 |
| Original Closing Date for Applications: | Dec 16, 2016 |
| Current Closing Date for Applications: | Jan 13, 2017 |
| Archive Date: | Jul 13, 2017 |
| Estimated Total Program Funding: | – |
| Award Ceiling: | – |
| Award Floor: | – |
Eligibility
| Eligible Applicants: | Unrestricted (i.e., open to any type of entity above), subject to any clarification in text field entitled “Additional Information on Eligibility” |
| Additional Information on Eligibility: | – |
Additional Information
| Agency Name: | DARPA – Microsystems Technology Office |
| Description: | Amendment 02: The purpose of this amendment is to add a header to the Full Proposal Format section. See the changes as highlighted in yellow in the attached conformed DARPA-BAA-16-62 document.
Amendment 01: The purpose of this amendment is to update the Proposal Due Date and FAQ Deadline. See the changes as highlighted in yellow in the attached DARPA-BAA-16-62 document.Original Synopsis Below.The Common Heterogeneous Integration and Intellectual Property (IP) Reuse Strategies (CHIPS) program will develop the design tools and integration standards required to demonstrate modular integrated circuit (IC) designs that leverage the best of DoD and commercial designs and technology.See the attached DARPA-BAA-16-62 document. |
| Link to Additional Information: | DARPA Solicitations Page |
| Grantor Contact Information: | If you have difficulty accessing the full announcement electronically, please contact:
Dr. Daniel Green
MTO Program Manager Email:DARPA-BAA-16-62@darpa.mil |
DISPLAYING: Synopsis 3
General Information
| Document Type: | Grants Notice |
| Funding Opportunity Number: | DARPA-BAA-16-62 |
| Funding Opportunity Title: | Common Heterogeneous Integration and IP Reuse Strategies (CHIPS) |
| Opportunity Category: | Discretionary |
| Opportunity Category Explanation: | – |
| Funding Instrument Type: | Cooperative Agreement Grant Other Procurement Contract |
| Category of Funding Activity: | Science and Technology and other Research and Development |
| Category Explanation: | – |
| Expected Number of Awards: | – |
| Assistance Listings: | 12.910 — Research and Technology Development |
| Cost Sharing or Matching Requirement: | No |
| Version: | Synopsis 3 |
| Posted Date: | Dec 21, 2016 |
| Last Updated Date: | Dec 21, 2016 |
| Original Closing Date for Applications: | – |
| Current Closing Date for Applications: | Jan 13, 2017 |
| Archive Date: | Jul 13, 2017 |
| Estimated Total Program Funding: | – |
| Award Ceiling: | – |
| Award Floor: | – |
Eligibility
| Eligible Applicants: | Unrestricted (i.e., open to any type of entity above), subject to any clarification in text field entitled “Additional Information on Eligibility” |
| Additional Information on Eligibility: | – |
Additional Information
| Agency Name: | DARPA – Microsystems Technology Office |
| Description: | Amendment 01: The purpose of this amendment is to update the Proposal Due Date and FAQ Deadline. See the changes as highlighted in yellow in the attached DARPA-BAA-16-62 document.Original Synopsis Below.The Common Heterogeneous Integration and Intellectual Property (IP) Reuse Strategies (CHIPS) program will develop the design tools and integration standards required to demonstrate modular integrated circuit (IC) designs that leverage the best of DoD and commercial designs and technology.See the attached DARPA-BAA-16-62 document. |
| Link to Additional Information: | DARPA Solicitations Page |
| Grantor Contact Information: | If you have difficulty accessing the full announcement electronically, please contact:
Dr. Daniel Green
MTO Program Manager Email:DARPA-BAA-16-62@darpa.mil |
DISPLAYING: Synopsis 2
General Information
| Document Type: | Grants Notice |
| Funding Opportunity Number: | DARPA-BAA-16-62 |
| Funding Opportunity Title: | Common Heterogeneous Integration and IP Reuse Strategies (CHIPS) |
| Opportunity Category: | Discretionary |
| Opportunity Category Explanation: | – |
| Funding Instrument Type: | Cooperative Agreement Grant Other Procurement Contract |
| Category of Funding Activity: | Science and Technology and other Research and Development |
| Category Explanation: | – |
| Expected Number of Awards: | – |
| Assistance Listings: | 12.910 — Research and Technology Development |
| Cost Sharing or Matching Requirement: | No |
| Version: | Synopsis 2 |
| Posted Date: | Dec 21, 2016 |
| Last Updated Date: | Nov 22, 2016 |
| Original Closing Date for Applications: | – |
| Current Closing Date for Applications: | Jan 13, 2017 |
| Archive Date: | Jul 13, 2017 |
| Estimated Total Program Funding: | – |
| Award Ceiling: | – |
| Award Floor: | – |
Eligibility
| Eligible Applicants: | Unrestricted (i.e., open to any type of entity above), subject to any clarification in text field entitled “Additional Information on Eligibility” |
| Additional Information on Eligibility: | – |
Additional Information
| Agency Name: | DARPA – Microsystems Technology Office |
| Description: | Amendment 01: The purpose of this amendment is to update the Proposal Due Date and FAQ Deadline. See the changes as highlighted in yellow in the attached DARPA-BAA-16-62 document.
Original Synopsis Below. |
| Link to Additional Information: | DARPA Solicitations Page |
| Grantor Contact Information: | If you have difficulty accessing the full announcement electronically, please contact:
Dr. Daniel Green
MTO Program Manager Email:DARPA-BAA-16-62@darpa.mil |
DISPLAYING: Synopsis 1
General Information
| Document Type: | Grants Notice |
| Funding Opportunity Number: | DARPA-BAA-16-62 |
| Funding Opportunity Title: | Common Heterogeneous Integration and IP Reuse Strategies (CHIPS) |
| Opportunity Category: | Discretionary |
| Opportunity Category Explanation: | – |
| Funding Instrument Type: | Cooperative Agreement Grant Other Procurement Contract |
| Category of Funding Activity: | Science and Technology and other Research and Development |
| Category Explanation: | – |
| Expected Number of Awards: | – |
| Assistance Listings: | 12.910 — Research and Technology Development |
| Cost Sharing or Matching Requirement: | No |
| Version: | Synopsis 1 |
| Posted Date: | Nov 22, 2016 |
| Last Updated Date: | – |
| Original Closing Date for Applications: | – |
| Current Closing Date for Applications: | Dec 16, 2016 |
| Archive Date: | Jun 16, 2017 |
| Estimated Total Program Funding: | – |
| Award Ceiling: | – |
| Award Floor: | – |
Eligibility
| Eligible Applicants: | Unrestricted (i.e., open to any type of entity above), subject to any clarification in text field entitled “Additional Information on Eligibility” |
| Additional Information on Eligibility: | – |
Additional Information
| Agency Name: | DARPA – Microsystems Technology Office |
| Description: | The Common Heterogeneous Integration and Intellectual Property (IP) Reuse Strategies (CHIPS) program will develop the design tools and integration standards required to demonstrate modular integrated circuit (IC) designs that leverage the best of DoD and commercial designs and technology.
See the attached DARPA-BAA-16-62 document. |
| Link to Additional Information: | DARPA Solicitations Page |
| Grantor Contact Information: | If you have difficulty accessing the full announcement electronically, please contact:
Dr. Daniel Green
MTO Program Manager Email:DARPA-BAA-16-62@darpa.mil |
Related Documents
Folder 289238 Full Announcement-Amendment 02 -> DARPA-BAA-16-62_CHIPS_Amendment_2_21Dec16.pdf
Folder 289238 Full Announcement-DARPA-BAA-16-62 -> DARPA-BAA_16-62_Attachment+1_Proposer+Checklist (1).pdf
Folder 289238 Full Announcement-DARPA-BAA-16-62 -> DARPA-BAA-16-62_final for posting_29SEPT16.pdf
Folder 289238 Full Announcement-DARPA-BAA-16-62 -> DARPA-BAA-16-62_Attachment_2_Proposal_Summary_Chart_CHIPS (1).pdf
Folder 289238 Revised Full Announcement-Amendment 01 -> DARPA-BAA-16-62_CHIPS_Amendment_01_Final for Posting_22 Nov. 2016.pdf
Packages
| Agency Contact Information: | Dr. Daniel Green MTO Program Manager Email: DARPA-BAA-16-62@darpa.mil |
| Who Can Apply: | Organization Applicants |
| Assistance Listing Number | Competition ID | Competition Title | Opportunity Package ID | Opening Date | Closing Date | Actions |
|---|---|---|---|---|---|---|
| 12.910 | PKG00228352 | Sep 29, 2016 | Jan 13, 2017 | View |
Package 1
Mandatory forms
289238 RR_SF424_2_0-2.0.pdf
289238 AttachmentForm_1_2-1.2.pdf
Optional forms
289238 SFLLL_1_2-1.2.pdf
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