The DARPA Microsystems Technology Office is offering a grant for the research and development of low temperature (77K) FinFET technology to enhance the performance and power efficiency of central processing units (CPU). This grant aims to achieve a 25X improvement in performance/power compared to room temperature operation. Amendment 01 has been issued to clarify specific sections in the proposal guidelines. Deadline for proposal submission is May 18, 2021.
Opportunity ID: 332029
General Information
| Document Type: | Grants Notice |
| Funding Opportunity Number: | HR001121S0019 |
| Funding Opportunity Title: | Low Temperature Logic Technology (LTLT) |
| Opportunity Category: | Discretionary |
| Opportunity Category Explanation: | – |
| Funding Instrument Type: | Cooperative Agreement Grant Other Procurement Contract |
| Category of Funding Activity: | Science and Technology and other Research and Development |
| Category Explanation: | – |
| Expected Number of Awards: | – |
| Assistance Listings: | 12.910 — Research and Technology Development |
| Cost Sharing or Matching Requirement: | No |
| Version: | Synopsis 2 |
| Posted Date: | Mar 10, 2021 |
| Last Updated Date: | Mar 30, 2021 |
| Original Closing Date for Applications: | May 18, 2021 See Full Announcement for details. |
| Current Closing Date for Applications: | May 18, 2021 See Full Announcement for details. |
| Archive Date: | Nov 30, 2021 |
| Estimated Total Program Funding: | – |
| Award Ceiling: | – |
| Award Floor: | – |
Eligibility
| Eligible Applicants: | Others (see text field entitled “Additional Information on Eligibility” for clarification) |
| Additional Information on Eligibility: | All responsible sources capable of satisfying the Government’s needs may submit a proposal that shall be considered by DARPA. See the Eligibility Information section of the BAA for more information. |
Additional Information
| Agency Name: | DARPA – Microsystems Technology Office |
| Description: | Amendment 01: The purpose of this amendment is to clarify errors in Section IV.B.6. “Approved Cost Accounting System Documentation,” and Section IV.B.9. “Small Business Subcontracting Plan.”
The DARPA Microsystems Technology Office is soliciting research proposals for the development of low temperature (77K) FinFET technology to achieve a 25X improvement in the performance/power of state-of-the-art (SOA) central processing units (CPU) compared to room temperature (RT) operation. |
| Link to Additional Information: | Beta.SAM Contract Opportunities |
| Grantor Contact Information: | If you have difficulty accessing the full announcement electronically, please contact:
BAA Coordinator
HR001121S0019@darpa.mil Email:HR001121S0019@darpa.mil |
Version History
| Version | Modification Description | Updated Date |
|---|---|---|
| The purpose of this amendment is to clarify errors in Section IV.B.6. “Approved Cost Accounting System Documentation,” and Section IV.B.9. “Small Business Subcontracting Plan.” | Mar 30, 2021 | |
| Mar 10, 2021 |
DISPLAYING: Synopsis 2
General Information
| Document Type: | Grants Notice |
| Funding Opportunity Number: | HR001121S0019 |
| Funding Opportunity Title: | Low Temperature Logic Technology (LTLT) |
| Opportunity Category: | Discretionary |
| Opportunity Category Explanation: | – |
| Funding Instrument Type: | Cooperative Agreement Grant Other Procurement Contract |
| Category of Funding Activity: | Science and Technology and other Research and Development |
| Category Explanation: | – |
| Expected Number of Awards: | – |
| Assistance Listings: | 12.910 — Research and Technology Development |
| Cost Sharing or Matching Requirement: | No |
| Version: | Synopsis 2 |
| Posted Date: | Mar 10, 2021 |
| Last Updated Date: | Mar 30, 2021 |
| Original Closing Date for Applications: | May 18, 2021 See Full Announcement for details. |
| Current Closing Date for Applications: | May 18, 2021 See Full Announcement for details. |
| Archive Date: | Nov 30, 2021 |
| Estimated Total Program Funding: | – |
| Award Ceiling: | – |
| Award Floor: | – |
Eligibility
| Eligible Applicants: | Others (see text field entitled “Additional Information on Eligibility” for clarification) |
| Additional Information on Eligibility: | All responsible sources capable of satisfying the Government’s needs may submit a proposal that shall be considered by DARPA. See the Eligibility Information section of the BAA for more information. |
Additional Information
| Agency Name: | DARPA – Microsystems Technology Office |
| Description: | Amendment 01: The purpose of this amendment is to clarify errors in Section IV.B.6. “Approved Cost Accounting System Documentation,” and Section IV.B.9. “Small Business Subcontracting Plan.”
The DARPA Microsystems Technology Office is soliciting research proposals for the development of low temperature (77K) FinFET technology to achieve a 25X improvement in the performance/power of state-of-the-art (SOA) central processing units (CPU) compared to room temperature (RT) operation. |
| Link to Additional Information: | Beta.SAM Contract Opportunities |
| Grantor Contact Information: | If you have difficulty accessing the full announcement electronically, please contact:
BAA Coordinator
HR001121S0019@darpa.mil Email:HR001121S0019@darpa.mil |
DISPLAYING: Synopsis 1
General Information
| Document Type: | Grants Notice |
| Funding Opportunity Number: | HR001121S0019 |
| Funding Opportunity Title: | Low Temperature Logic Technology (LTLT) |
| Opportunity Category: | Discretionary |
| Opportunity Category Explanation: | – |
| Funding Instrument Type: | Cooperative Agreement Grant Other Procurement Contract |
| Category of Funding Activity: | Science and Technology and other Research and Development |
| Category Explanation: | – |
| Expected Number of Awards: | – |
| Assistance Listings: | 12.910 — Research and Technology Development |
| Cost Sharing or Matching Requirement: | No |
| Version: | Synopsis 1 |
| Posted Date: | Mar 10, 2021 |
| Last Updated Date: | Mar 10, 2021 |
| Original Closing Date for Applications: | – |
| Current Closing Date for Applications: | May 18, 2021 See Full Announcement for details. |
| Archive Date: | Nov 30, 2021 |
| Estimated Total Program Funding: | – |
| Award Ceiling: | – |
| Award Floor: | – |
Eligibility
| Eligible Applicants: | Others (see text field entitled “Additional Information on Eligibility” for clarification) |
| Additional Information on Eligibility: | All responsible sources capable of satisfying the Government’s needs may submit a proposal that shall be considered by DARPA. See the Eligibility Information section of the BAA for more information. |
Additional Information
| Agency Name: | DARPA – Microsystems Technology Office |
| Description: | The DARPA Microsystems Technology Office is soliciting research proposals for the development of low temperature (77K) FinFET technology to achieve a 25X improvement in the performance/power of state-of-the-art (SOA) central processing units (CPU) compared to room temperature (RT) operation. |
| Link to Additional Information: | Beta.SAM Contract Opportunities |
| Grantor Contact Information: | If you have difficulty accessing the full announcement electronically, please contact:
BAA Coordinator
HR001121S0019@darpa.mil Email:HR001121S0019@darpa.mil |
Related Documents
Folder 332029 Full Announcement-HR001121S0019 -> HR001121S0019_Att 1_Proposer Checklist.pdf
Folder 332029 Full Announcement-HR001121S0019 -> HR001121S0019.pdf
Folder 332029 Full Announcement-HR001121S0019 -> HR001121S0019_Att 3_Controlled Unclassified Information (CUI) Guide.pdf
Folder 332029 Full Announcement-HR001121S0019 -> HR001121S0019_Att 2_Proposal_Summary_Chart.pdf
Folder 332029 Revised Full Announcement-HR001121S0019-Amendment-01 -> HR001121S0019-Amendment-01.pdf
Packages
| Agency Contact Information: | BAA Coordinator HR001121S0019@darpa.mil Email: HR001121S0019@darpa.mil |
| Who Can Apply: | Organization Applicants |
| Assistance Listing Number | Competition ID | Competition Title | Opportunity Package ID | Opening Date | Closing Date | Actions |
|---|---|---|---|---|---|---|
| 12.910 | PKG00265861 | Mar 30, 2021 | May 18, 2021 | View |
Package 1
Mandatory forms
332029 RR_SF424_3_0-3.0.pdf
332029 AttachmentForm_1_2-1.2.pdf
332029 RR_KeyPersonExpanded_3_0-3.0.pdf
332029 RR_PersonalData_1_2-1.2.pdf
Optional forms
332029 SFLLL_2_0-2.0.pdf
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