This department is offering a grant for firms to conduct market research on 3D High Density Microelectronics for Information Protection. The focus is on developing ultra-high density microelectronics modules for use in Critical Program Information protection applications, aiming to improve product yield and expand production facilities for a economically viable supplier. The grant amount provided is an estimate of $100,000 with potential additional funding to be determined later. Application deadline is Feb 05, 2016, 12:00 AM EST.
Opportunity ID: 280840
General Information
| Document Type: | Grants Notice |
| Funding Opportunity Number: | RFI-AFRL-RQKM-2016-0011 |
| Funding Opportunity Title: | Defense Production Act (DPA) Title III Technology Market Research for 3D Microelectronics for Information Protection Project |
| Opportunity Category: | Discretionary |
| Opportunity Category Explanation: | CategoryExplanation |
| Funding Instrument Type: | Cooperative Agreement |
| Category of Funding Activity: | Science and Technology and other Research and Development |
| Category Explanation: | – |
| Expected Number of Awards: | 1 |
| Assistance Listings: | 12.800 — Air Force Defense Research Sciences Program |
| Cost Sharing or Matching Requirement: | Yes |
| Version: | Synopsis 1 |
| Posted Date: | Jan 06, 2016 |
| Last Updated Date: | – |
| Original Closing Date for Applications: | Feb 05, 2016 |
| Current Closing Date for Applications: | Feb 05, 2016 |
| Archive Date: | Mar 06, 2016 |
| Estimated Total Program Funding: | $100,000 |
| Award Ceiling: | – |
| Award Floor: | – |
Eligibility
| Eligible Applicants: | Unrestricted (i.e., open to any type of entity above), subject to any clarification in text field entitled “Additional Information on Eligibility” |
| Additional Information on Eligibility: | – |
Additional Information
| Agency Name: | Air Force — Research Lab |
| Description: | The Title III program has identified 3D High Density Microelectronics for Information Protection as a technology area of interest for its future activities, and interested firms are encouraged to determine if they have information pertaining to this topic. For the purpose of this RFI, the Government is defining 3D High Density Microelectronics for Information Protection as three-dimensional (3D), ultra-high density microelectronics modules for use in Critical Program Information (CPI) protection applications. The focus shall be on product yield improvement and the expansion of production facilities to create an economically viable DoD and commercial supplier of 3D microelectronics modules incorporating Information Protection. Note: The program funding above ($100,000) is an estimate only and does not reflect any potential program funding which will be determined at a later date. |
| Link to Additional Information: | – |
| Grantor Contact Information: | If you have difficulty accessing the full announcement electronically, please contact:
Diana C. Aniton
Contracting/Agreements Officer Phone 937-713-9897 Email:dianna.aniton@us.af.mil |
Version History
| Version | Modification Description | Updated Date |
|---|---|---|
Related Documents
Folder 280840 Other Supporting Documents-Request For Information (RFI) 1 -> rfi-afrl-rqkm-2016-0011.pdf
Packages
| Agency Contact Information: | Diana C. Aniton Contracting/Agreements Officer Phone 937-713-9897 Email: dianna.aniton@us.af.mil |
| Who Can Apply: | Organization Applicants |
| Assistance Listing Number | Competition ID | Competition Title | Opportunity Package ID | Opening Date | Closing Date | Actions |
|---|---|---|---|---|---|---|
| 12.800 | PKG00220362 | Jan 06, 2016 | Feb 05, 2016 | View |
Package 1
Mandatory forms
280840 RR_SF424_2_0-2.0.pdf
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