Opportunity ID: 346349
General Information
| Document Type: | Grants Notice |
| Funding Opportunity Number: | 2023-NIST-CHIPS-CFF-01 |
| Funding Opportunity Title: | CHIPS Incentives Program – Commercial Fabrication Facilities |
| Opportunity Category: | Discretionary |
| Opportunity Category Explanation: | – |
| Funding Instrument Type: | Other |
| Category of Funding Activity: | Science and Technology and other Research and Development |
| Category Explanation: | – |
| Expected Number of Awards: | 500 |
| Assistance Listings: | 11.037 — CHIPS Incentives Program |
| Cost Sharing or Matching Requirement: | No |
| Version: | Synopsis 18 |
| Posted Date: | Feb 23, 2023 |
| Last Updated Date: | Jul 15, 2024 |
| Original Closing Date for Applications: | – Rolling NOFO |
| Current Closing Date for Applications: | Jun 18, 2024 |
| Archive Date: | – |
| Estimated Total Program Funding: | – |
| Award Ceiling: | – |
| Award Floor: | – |
Eligibility
| Eligible Applicants: | Others (see text field entitled “Additional Information on Eligibility” for clarification) |
| Additional Information on Eligibility: | An applicant must be a “covered entity” to receive CHIPS Incentives. For purposes of this NOFO, a “covered entity” means a nonprofit entity; a private-sector entity; a consortium of private-sector entities; or a consortium of nonprofit, public, and private-sector entities with a demonstrated ability to substantially finance, construct, expand, or modernize a facility relating to fabrication, assembly, testing, advanced packaging, or production of semiconductors. |
Additional Information
| Agency Name: | National Institute of Standards and Technology |
| Description: |
The CHIPS Incentives Program aims to catalyze long-term economically sustainable growth in the domestic semiconductor industry in support of U.S. economic and national security. This is the first Notice of Funding Opportunity under this program. It seeks applications for projects for the construction, expansion, or modernization of commercial facilities for the front- and back-end fabrication of leading-edge, current-generation, and mature-node semiconductors. For more information, additional resources, and instructions on how to apply, please visit chips.gov. Note that all applications must be submitted through the CHIPS Incentives Portal at http://applications.chips.gov. If you have any questions on how to apply, please email apply@chips.gov. |
| Link to Additional Information: | CHIPS Application portal |
| Grantor Contact Information: | If you have difficulty accessing the full announcement electronically, please contact:
Misty Roosa
Management Analyst Email:apply@chips.gov |
Version History
| Version | Modification Description | Updated Date |
|---|---|---|
| This amendment makes a minor update to the award process that does not impact application submission requirements | Jul 15, 2024 | |
| date updated | Feb 23, 2023 | |
| This amendment introduces submission dates and revises timelines of the original February 2023 funding opportunity and the amended June 2023 funding opportunity. This amendment introduces submission dates for pre-applications and full applications and revises required statement of interest timelines. | Feb 23, 2023 | |
| This amendment expands the scope of the February 2023 funding opportunity to accept applications for the construction, expansion, or modernization of semiconductor materials and manufacturing equipment facilities for which the capital investment equals or exceeds $300 million. | Feb 23, 2023 | |
| Feb 23, 2023 |
DISPLAYING: Synopsis 18
General Information
| Document Type: | Grants Notice |
| Funding Opportunity Number: | 2023-NIST-CHIPS-CFF-01 |
| Funding Opportunity Title: | CHIPS Incentives Program – Commercial Fabrication Facilities |
| Opportunity Category: | Discretionary |
| Opportunity Category Explanation: | – |
| Funding Instrument Type: | Other |
| Category of Funding Activity: | Science and Technology and other Research and Development |
| Category Explanation: | – |
| Expected Number of Awards: | 500 |
| Assistance Listings: | 11.037 — CHIPS Incentives Program |
| Cost Sharing or Matching Requirement: | No |
| Version: | Synopsis 18 |
| Posted Date: | Feb 23, 2023 |
| Last Updated Date: | Jul 15, 2024 |
| Original Closing Date for Applications: | – Rolling NOFO |
| Current Closing Date for Applications: | Jun 18, 2024 |
| Archive Date: | – |
| Estimated Total Program Funding: | – |
| Award Ceiling: | – |
| Award Floor: | – |
Eligibility
| Eligible Applicants: | Others (see text field entitled “Additional Information on Eligibility” for clarification) |
| Additional Information on Eligibility: | An applicant must be a “covered entity” to receive CHIPS Incentives. For purposes of this NOFO, a “covered entity” means a nonprofit entity; a private-sector entity; a consortium of private-sector entities; or a consortium of nonprofit, public, and private-sector entities with a demonstrated ability to substantially finance, construct, expand, or modernize a facility relating to fabrication, assembly, testing, advanced packaging, or production of semiconductors. |
Additional Information
| Agency Name: | National Institute of Standards and Technology |
| Description: |
The CHIPS Incentives Program aims to catalyze long-term economically sustainable growth in the domestic semiconductor industry in support of U.S. economic and national security. This is the first Notice of Funding Opportunity under this program. It seeks applications for projects for the construction, expansion, or modernization of commercial facilities for the front- and back-end fabrication of leading-edge, current-generation, and mature-node semiconductors. For more information, additional resources, and instructions on how to apply, please visit chips.gov. Note that all applications must be submitted through the CHIPS Incentives Portal at http://applications.chips.gov. If you have any questions on how to apply, please email apply@chips.gov. |
| Link to Additional Information: | CHIPS Application portal |
| Grantor Contact Information: | If you have difficulty accessing the full announcement electronically, please contact:
Misty Roosa
Management Analyst Email:apply@chips.gov |
DISPLAYING: Synopsis 17
General Information
| Document Type: | Grants Notice |
| Funding Opportunity Number: | 2023-NIST-CHIPS-CFF-01 |
| Funding Opportunity Title: | CHIPS Incentives Program – Commercial Fabrication Facilities |
| Opportunity Category: | Discretionary |
| Opportunity Category Explanation: | – |
| Funding Instrument Type: | Other |
| Category of Funding Activity: | Science and Technology and other Research and Development |
| Category Explanation: | – |
| Expected Number of Awards: | 500 |
| Assistance Listings: | 11.037 — CHIPS Incentives Program |
| Cost Sharing or Matching Requirement: | No |
| Version: | Synopsis 17 |
| Posted Date: | Feb 23, 2023 |
| Last Updated Date: | May 29, 2024 |
| Original Closing Date for Applications: | – |
| Current Closing Date for Applications: | Jun 18, 2024 |
| Archive Date: | – |
| Estimated Total Program Funding: | – |
| Award Ceiling: | – |
| Award Floor: | – |
Eligibility
| Eligible Applicants: | Others (see text field entitled “Additional Information on Eligibility” for clarification) |
| Additional Information on Eligibility: | An applicant must be a “covered entity” to receive CHIPS Incentives. For purposes of this NOFO, a “covered entity” means a nonprofit entity; a private-sector entity; a consortium of private-sector entities; or a consortium of nonprofit, public, and private-sector entities with a demonstrated ability to substantially finance, construct, expand, or modernize a facility relating to fabrication, assembly, testing, advanced packaging, or production of semiconductors. |
Additional Information
| Agency Name: | National Institute of Standards and Technology |
| Description: |
The CHIPS Incentives Program aims to catalyze long-term economically sustainable growth in the domestic semiconductor industry in support of U.S. economic and national security. This is the first Notice of Funding Opportunity under this program. It seeks applications for projects for the construction, expansion, or modernization of commercial facilities for the front- and back-end fabrication of leading-edge, current-generation, and mature-node semiconductors. For more information, additional resources, and instructions on how to apply, please visit chips.gov. Note that all applications must be submitted through the CHIPS Incentives Portal at http://applications.chips.gov. If you have any questions on how to apply, please email apply@chips.gov. |
| Link to Additional Information: | CHIPS Application portal |
| Grantor Contact Information: | If you have difficulty accessing the full announcement electronically, please contact:
Misty Roosa
Management Analyst Email:apply@chips.gov |
DISPLAYING: Synopsis 16
General Information
| Document Type: | Grants Notice |
| Funding Opportunity Number: | 2023-NIST-CHIPS-CFF-01 |
| Funding Opportunity Title: | CHIPS Incentives Program – Commercial Fabrication Facilities |
| Opportunity Category: | Discretionary |
| Opportunity Category Explanation: | – |
| Funding Instrument Type: | Other |
| Category of Funding Activity: | Science and Technology and other Research and Development |
| Category Explanation: | – |
| Expected Number of Awards: | 500 |
| Assistance Listings: | 11.037 — CHIPS Incentives Program |
| Cost Sharing or Matching Requirement: | No |
| Version: | Synopsis 16 |
| Posted Date: | Feb 23, 2023 |
| Last Updated Date: | Apr 19, 2024 |
| Original Closing Date for Applications: | – |
| Current Closing Date for Applications: | – Rolling NOFO |
| Archive Date: | – |
| Estimated Total Program Funding: | – |
| Award Ceiling: | – |
| Award Floor: | – |
Eligibility
| Eligible Applicants: | Others (see text field entitled “Additional Information on Eligibility” for clarification) |
| Additional Information on Eligibility: | An applicant must be a “covered entity” to receive CHIPS Incentives. For purposes of this NOFO, a “covered entity” means a nonprofit entity; a private-sector entity; a consortium of private-sector entities; or a consortium of nonprofit, public, and private-sector entities with a demonstrated ability to substantially finance, construct, expand, or modernize a facility relating to fabrication, assembly, testing, advanced packaging, or production of semiconductors. |
Additional Information
| Agency Name: | National Institute of Standards and Technology |
| Description: |
The CHIPS Incentives Program aims to catalyze long-term economically sustainable growth in the domestic semiconductor industry in support of U.S. economic and national security. This is the first Notice of Funding Opportunity under this program. It seeks applications for projects for the construction, expansion, or modernization of commercial facilities for the front- and back-end fabrication of leading-edge, current-generation, and mature-node semiconductors. For more information, additional resources, and instructions on how to apply, please visit chips.gov. Note that all applications must be submitted through the CHIPS Incentives Portal at http://applications.chips.gov. If you have any questions on how to apply, please email apply@chips.gov. |
| Link to Additional Information: | CHIPS Application portal |
| Grantor Contact Information: | If you have difficulty accessing the full announcement electronically, please contact:
Misty Roosa
Management Analyst Email:apply@chips.gov |
DISPLAYING: Synopsis 15
General Information
| Document Type: | Grants Notice |
| Funding Opportunity Number: | 2023-NIST-CHIPS-CFF-01 |
| Funding Opportunity Title: | CHIPS Incentives Program – Commercial Fabrication Facilities |
| Opportunity Category: | Discretionary |
| Opportunity Category Explanation: | – |
| Funding Instrument Type: | Other |
| Category of Funding Activity: | Science and Technology and other Research and Development |
| Category Explanation: | – |
| Expected Number of Awards: | 500 |
| Assistance Listings: | 11.037 — CHIPS Incentives Program |
| Cost Sharing or Matching Requirement: | No |
| Version: | Synopsis 15 |
| Posted Date: | Feb 23, 2023 |
| Last Updated Date: | Jun 23, 2023 |
| Original Closing Date for Applications: | – |
| Current Closing Date for Applications: | – Rolling NOFO |
| Archive Date: | – |
| Estimated Total Program Funding: | – |
| Award Ceiling: | – |
| Award Floor: | – |
Eligibility
| Eligible Applicants: | Others (see text field entitled “Additional Information on Eligibility” for clarification) |
| Additional Information on Eligibility: | An applicant must be a “covered entity” to receive CHIPS Incentives. For purposes of this NOFO, a “covered entity” means a nonprofit entity; a private-sector entity; a consortium of private-sector entities; or a consortium of nonprofit, public, and private-sector entities with a demonstrated ability to substantially finance, construct, expand, or modernize a facility relating to fabrication, assembly, testing, advanced packaging, or production of semiconductors. |
Additional Information
| Agency Name: | National Institute of Standards and Technology |
| Description: |
The CHIPS Incentives Program aims to catalyze long-term economically sustainable growth in the domestic semiconductor industry in support of U.S. economic and national security. This is the first Notice of Funding Opportunity under this program. It seeks applications for projects for the construction, expansion, or modernization of commercial facilities for the front- and back-end fabrication of leading-edge, current-generation, and mature-node semiconductors. For more information, additional resources, and instructions on how to apply, please visit chips.gov. Note that all applications must be submitted through the CHIPS Incentives Portal at http://applications.chips.gov. If you have any questions on how to apply, please email apply@chips.gov. |
| Link to Additional Information: | CHIPS Application portal |
| Grantor Contact Information: | If you have difficulty accessing the full announcement electronically, please contact:
Misty Roosa
Management Analyst Email:apply@chips.gov |
DISPLAYING: Synopsis 14
General Information
| Document Type: | Grants Notice |
| Funding Opportunity Number: | 2023-NIST-CHIPS-CFF-01 |
| Funding Opportunity Title: | CHIPS Incentives Program – Commercial Fabrication Facilities |
| Opportunity Category: | Discretionary |
| Opportunity Category Explanation: | – |
| Funding Instrument Type: | Other |
| Category of Funding Activity: | Science and Technology and other Research and Development |
| Category Explanation: | – |
| Expected Number of Awards: | 500 |
| Assistance Listings: | 11.037 — CHIPS Incentives Program |
| Cost Sharing or Matching Requirement: | No |
| Version: | Synopsis 14 |
| Posted Date: | Feb 23, 2023 |
| Last Updated Date: | Feb 28, 2023 |
| Original Closing Date for Applications: | – |
| Current Closing Date for Applications: | – Rolling NOFO |
| Archive Date: | – |
| Estimated Total Program Funding: | – |
| Award Ceiling: | – |
| Award Floor: | – |
Eligibility
| Eligible Applicants: | Others (see text field entitled “Additional Information on Eligibility” for clarification) |
| Additional Information on Eligibility: | An applicant must be a “covered entity” to receive CHIPS Incentives. For purposes of this NOFO, a “covered entity” means a nonprofit entity; a private-sector entity; a consortium of private-sector entities; or a consortium of nonprofit, public, and private-sector entities with a demonstrated ability to substantially finance, construct, expand, or modernize a facility relating to fabrication, assembly, testing, advanced packaging, or production of semiconductors. |
Additional Information
| Agency Name: | National Institute of Standards and Technology |
| Description: |
The CHIPS Incentives Program aims to catalyze long-term economically sustainable growth in the domestic semiconductor industry in support of U.S. economic and national security. This is the first Notice of Funding Opportunity under this program. It seeks applications for projects for the construction, expansion, or modernization of commercial facilities for the front- and back-end fabrication of leading-edge, current-generation, and mature-node semiconductors. For more information, additional resources, and instructions on how to apply, please visit chips.gov. Note that all applications must be submitted through the CHIPS Incentives Portal at http://applications.chips.gov. If you have any questions on how to apply, please email apply@chips.gov. |
| Link to Additional Information: | CHIPS Application portal |
| Grantor Contact Information: | If you have difficulty accessing the full announcement electronically, please contact:
Misty Roosa
Management Analyst Email:apply@chips.gov |
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