This DARPA grant, ICECool Fundamentals, aims to develop the foundational technologies for advanced intra- and interchip evaporative microfluidic cooling. This grant is for researchers to establish the fundamental building blocks of such systems, including developing essential microfabrication techniques needed for multiply-microchanneled semiconductor wafers. Recipients will also focus on studying, modeling, and correlating the thermofluidic characteristics of evaporative flows within these microchannel flow loops, both within individual chips and in the microgaps between chips in 3D stacks. This initiative represents the critical initial phase towards achieving the broader objectives of the ICECool program, addressing enhanced cooling challenges in high-density electronics.
Opportunity ID: 175093
General Information
| Document Type: | Grants Notice |
| Funding Opportunity Number: | DARPA-BAA-12-50 |
| Funding Opportunity Title: | Intrachip/Interchip Enhanced Cooling Fundamentals (ICECool Fundamentals) |
| Opportunity Category: | Discretionary |
| Opportunity Category Explanation: | CategoryExplanation |
| Funding Instrument Type: | Cooperative Agreement Grant Other Procurement Contract |
| Category of Funding Activity: | Science and Technology and other Research and Development |
| Category Explanation: | – |
| Expected Number of Awards: | – |
| Assistance Listings: | 12.910 — Research and Technology Development |
| Cost Sharing or Matching Requirement: | No |
| Version: | Synopsis 2 |
| Posted Date: | Jun 07, 2012 |
| Last Updated Date: | Jul 19, 2012 |
| Original Closing Date for Applications: | Aug 30, 2012 |
| Current Closing Date for Applications: | Sep 13, 2012 |
| Archive Date: | Mar 14, 2013 |
| Estimated Total Program Funding: | – |
| Award Ceiling: | $0 |
| Award Floor: | $0 |
Eligibility
| Eligible Applicants: | Unrestricted (i.e., open to any type of entity above), subject to any clarification in text field entitled “Additional Information on Eligibility” |
| Additional Information on Eligibility: | – |
Additional Information
| Agency Name: | DARPA – Microsystems Technology Office |
| Description: | Amendment 01: The purpose of this Amendment is to revise the full proposal due date and to make technical revisions as highlighted in yellow in the attached conformed DARPA-BAA-12-50 document.
Original Synopsis below. The ICECool Fundamentals thrust is the first step toward achieving the goals of the ICECool program and will develop the fundamental building blocks of intra- and interchip evaporative microfluidic cooling. ICECool Fundamentals will develop and demonstrate the microfabrication techniquesneeded to implement evaporative microfluidics in multiply-microchanneled semiconductor wafers and study, model, and correlate the thermofluidic characteristics of evaporative flows in such microchannel flow loops within individual chips and/or in the microgaps between chips in 3D stacks. See the full DARPA-BAA-12-50 document attached. |
| Link to Additional Information: | MTO Solicitations Page |
| Grantor Contact Information: | If you have difficulty accessing the full announcement electronically, please contact:
Dr. Avram Bar-Cohen
Program Manager Email:DARPA-BAA-12-50@darpa.mil |
Version History
| Version | Modification Description | Updated Date |
|---|---|---|
| Amendment 01: The purpose of this Amendment is to revise the full proposal due date and to make technical revisions as highlighted in yellow in the attached conformed DARPA-BAA-12-50 document. | Jul 19, 2012 | |
| Jul 19, 2012 |
DISPLAYING: Synopsis 2
General Information
| Document Type: | Grants Notice |
| Funding Opportunity Number: | DARPA-BAA-12-50 |
| Funding Opportunity Title: | Intrachip/Interchip Enhanced Cooling Fundamentals (ICECool Fundamentals) |
| Opportunity Category: | Discretionary |
| Opportunity Category Explanation: | CategoryExplanation |
| Funding Instrument Type: | Cooperative Agreement Grant Other Procurement Contract |
| Category of Funding Activity: | Science and Technology and other Research and Development |
| Category Explanation: | – |
| Expected Number of Awards: | – |
| Assistance Listings: | 12.910 — Research and Technology Development |
| Cost Sharing or Matching Requirement: | No |
| Version: | Synopsis 2 |
| Posted Date: | Jun 07, 2012 |
| Last Updated Date: | Jul 19, 2012 |
| Original Closing Date for Applications: | Aug 30, 2012 |
| Current Closing Date for Applications: | Sep 13, 2012 |
| Archive Date: | Mar 14, 2013 |
| Estimated Total Program Funding: | – |
| Award Ceiling: | $0 |
| Award Floor: | $0 |
Eligibility
| Eligible Applicants: | Unrestricted (i.e., open to any type of entity above), subject to any clarification in text field entitled “Additional Information on Eligibility” |
| Additional Information on Eligibility: | – |
Additional Information
| Agency Name: | DARPA – Microsystems Technology Office |
| Description: | Amendment 01: The purpose of this Amendment is to revise the full proposal due date and to make technical revisions as highlighted in yellow in the attached conformed DARPA-BAA-12-50 document.
Original Synopsis below. The ICECool Fundamentals thrust is the first step toward achieving the goals of the ICECool program and will develop the fundamental building blocks of intra- and interchip evaporative microfluidic cooling. ICECool Fundamentals will develop and demonstrate the microfabrication techniquesneeded to implement evaporative microfluidics in multiply-microchanneled semiconductor wafers and study, model, and correlate the thermofluidic characteristics of evaporative flows in such microchannel flow loops within individual chips and/or in the microgaps between chips in 3D stacks. See the full DARPA-BAA-12-50 document attached. |
| Link to Additional Information: | MTO Solicitations Page |
| Grantor Contact Information: | If you have difficulty accessing the full announcement electronically, please contact:
Dr. Avram Bar-Cohen
Program Manager Email:DARPA-BAA-12-50@darpa.mil |
DISPLAYING: Synopsis 1
General Information
| Document Type: | Grants Notice |
| Funding Opportunity Number: | DARPA-BAA-12-50 |
| Funding Opportunity Title: | Intrachip/Interchip Enhanced Cooling Fundamentals (ICECool Fundamentals) |
| Opportunity Category: | Discretionary |
| Opportunity Category Explanation: | – |
| Funding Instrument Type: | Cooperative Agreement Grant Other Procurement Contract |
| Category of Funding Activity: | Science and Technology and other Research and Development |
| Category Explanation: | – |
| Expected Number of Awards: | – |
| Assistance Listings: | 12.910 — Research and Technology Development |
| Cost Sharing or Matching Requirement: | No |
| Version: | Synopsis 1 |
| Posted Date: | Jul 19, 2012 |
| Last Updated Date: | – |
| Original Closing Date for Applications: | – |
| Current Closing Date for Applications: | Aug 30, 2012 |
| Archive Date: | Feb 28, 2013 |
| Estimated Total Program Funding: | – |
| Award Ceiling: | $0 |
| Award Floor: | $0 |
Eligibility
| Eligible Applicants: | Unrestricted (i.e., open to any type of entity above), subject to any clarification in text field entitled “Additional Information on Eligibility” |
| Additional Information on Eligibility: | – |
Additional Information
| Agency Name: | DARPA – Microsystems Technology Office |
| Description: | The ICECool Fundamentals thrust is the first step toward achieving the goals of the ICECool program and will develop the fundamental building blocks of intra- and interchip evaporative microfluidic cooling. ICECool Fundamentals will develop and demonstrate the microfabrication techniques needed to implement evaporative microfluidics in multiply-microchanneled semiconductor wafers and study, model, and correlate the thermofluidic characteristics of evaporative flows in such microchannel flow loops within individual chips and/or in the microgaps between chips in 3D stacks. See the full DARPA-BAA-12-50 document attached. |
| Link to Additional Information: | MTO Solicitations Page |
| Grantor Contact Information: | If you have difficulty accessing the full announcement electronically, please contact:
Dr. Avram Bar-Cohen
Program Manager Email:DARPA-BAA-12-50@darpa.mil |
Related Documents
Folder 175093 Full Announcement-1 -> darpa-baa-12-50_icecool_final for posting_7jun12.pdf
Folder 175093 Full Announcement-1 -> attachment 1_approved proposer checklist.pdf
Folder 175093 Full Announcement-2 -> darpa-baa-12-50_icecool_amendment 01_final for posting_19july12.pdf
Packages
| Agency Contact Information: | Dr. Avram Bar-Cohen Program Manager Email: DARPA-BAA-12-50@darpa.mil |
| Who Can Apply: | Organization Applicants |
| Assistance Listing Number | Competition ID | Competition Title | Opportunity Package ID | Opening Date | Closing Date | Actions |
|---|---|---|---|---|---|---|
| 12.910 | PKG00125770 | Jun 07, 2012 | Sep 13, 2012 | View |
Package 1
Mandatory forms
175093 RR_SF424_1_2-1.2.pdf
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