The Department of State’s EB/TPN/MTA is offering this grant to advance U.S. foreign policy and national security priorities by diversifying global semiconductor supply chains. This initiative, funded by the CHIPS Act’s International Technology Security and Innovation Fund and FY 2023 ESF, seeks proposals to expand international semiconductor assembly, testing, and packaging (ATP) operations. The goal is to build resilient supply chains beneficial to new U.S. semiconductor manufacturing facilities, allies, and partners. This grant is for the purpose of strengthening the global semiconductor ecosystem in key partner countries within the Americas and Indo-Pacific regions.
Opportunity ID: 349537
General Information
| Document Type: | Grants Notice |
| Funding Opportunity Number: | SFOP0009975 |
| Funding Opportunity Title: | Diversifying Semiconductor Supply |
| Opportunity Category: | Discretionary |
| Opportunity Category Explanation: | – |
| Funding Instrument Type: | Cooperative Agreement |
| Category of Funding Activity: | Business and Commerce |
| Category Explanation: | – |
| Expected Number of Awards: | 1 |
| Assistance Listings: | 19.322 — Economic Statecraft |
| Cost Sharing or Matching Requirement: | No |
| Version: | Synopsis 1 |
| Posted Date: | Jul 25, 2023 |
| Last Updated Date: | Jul 25, 2023 |
| Original Closing Date for Applications: | Sep 29, 2023 |
| Current Closing Date for Applications: | Sep 29, 2023 |
| Archive Date: | – |
| Estimated Total Program Funding: | $13,800,000 |
| Award Ceiling: | $13,800,000 |
| Award Floor: | $13,800,000 |
Eligibility
| Eligible Applicants: | Nonprofits having a 501(c)(3) status with the IRS, other than institutions of higher education |
| Additional Information on Eligibility: |
Additional Information
| Agency Name: | Bureau of Economic and Business Affairs |
| Description: | The Department of State’s Bureau of Economic and Business Affairs, Office of Multilateral Trade Affairs (EB/TPN/MTA) is pleased to announce a new funding opportunity through this Notice of Funding Opportunity (NOFO). Under this NOFO, EB/TPN/MTA seeks proposals to advance U.S. foreign policy and national security priorities outlined in the Creating Helpful Incentives to Produce Semiconductors (CHIPS) Act of 2022 (Div. A, P.L. 117-167). The Act established a new International Technology Security and Innovation Fund (ITSI Fund) “to support the development and adoption of secure semiconductors, [and] semiconductor supply chains” with the goal to make the global semiconductor supply chain more resilient, diversified, and secure. EB/TPN/MTA administers a portion of the ITSI funds to help expand international semiconductor assembly, testing, and packaging capacity that will in turn diversify the global semiconductor supply chain. The CHIPS Act legislated that ITSI must build diverse and resilient semiconductor supply chains for U.S.-based industry needs. The goal of this project is to bring that capacity online in ways that will be beneficial to the new U.S. semiconductor manufacturing facilities as well as our allies and partners. EB/TPN/MTA has identified the key regulatory and policy levers to attract semiconductor supply chain investments, identified workforce development needs, and on regulatory and infrastructure impediments. Programming to be funded with FY 2023 Economic Support Funds (ESF) will diversify and expand the semiconductor chip assembly, testing, and packaging (“ATP” or “downstream”) operations in key partner countries in the Americas and the Indo-Pacific region. |
| Link to Additional Information: | Link to Opportunity in SAMS Domestic |
| Grantor Contact Information: | If you have difficulty accessing the full announcement electronically, please contact:
kentve@state.gov
Email:- |
Version History
| Version | Modification Description | Updated Date |
|---|---|---|
Related Documents
Folder 349537 Full Announcement-Notice of Funding Opportunity -> Budget Template.pdf
Folder 349537 Full Announcement-Notice of Funding Opportunity -> Q & A 8.28.pdf
Folder 349537 Full Announcement-Notice of Funding Opportunity -> NOFO Final 7.24.pdf
Folder 349537 Full Announcement-Notice of Funding Opportunity -> Budget Guidelines.pdf
Folder 349537 Full Announcement-Notice of Funding Opportunity -> Proposal Submission Instructions (PSI).pdf
Packages
| Agency Contact Information: | kentve@state.gov |
| Who Can Apply: | Organization Applicants |
| Assistance Listing Number | Competition ID | Competition Title | Opportunity Package ID | Opening Date | Closing Date | Actions |
|---|---|---|---|---|---|---|
| 19.322 | SFOP0009975 | Diversifying Semiconductor Supply | PKG00282664 | Jul 25, 2023 | Sep 29, 2023 | View |
Package 1
Mandatory forms
349537 SF424_4_0-4.0.pdf
349537 SF424A-1.0.pdf
349537 SF424B-1.1.pdf
349537 BudgetNarrativeAttachments_1_2-1.2.pdf
349537 ProjectNarrativeAttachments_1_2-1.2.pdf
Optional forms
349537 SFLLL_2_0-2.0.pdf
349537 AttachmentForm_1_2-1.2.pdf
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