Opportunity ID: 350338
General Information
| Document Type: | Grants Notice |
| Funding Opportunity Number: | 2023-NIST-CHIPS-SMME-01 |
| Funding Opportunity Title: | CHIPS Incentives Program – Facilities for Semiconductor Materials and Manufacturing Equipment |
| Opportunity Category: | Discretionary |
| Opportunity Category Explanation: | – |
| Funding Instrument Type: | Cooperative Agreement |
| Category of Funding Activity: | Science and Technology and other Research and Development |
| Category Explanation: | – |
| Expected Number of Awards: | – |
| Assistance Listings: | 11.037 — CHIPS Incentives Program |
| Cost Sharing or Matching Requirement: | No |
| Version: | Synopsis 8 |
| Posted Date: | Sep 26, 2023 |
| Last Updated Date: | Sep 29, 2023 |
| Original Closing Date for Applications: | – Rolling NOFO |
| Current Closing Date for Applications: | – Rolling NOFO |
| Archive Date: | Mar 02, 2024 |
| Estimated Total Program Funding: | – |
| Award Ceiling: | – |
| Award Floor: | – |
Eligibility
| Eligible Applicants: | Others (see text field entitled “Additional Information on Eligibility” for clarification) |
| Additional Information on Eligibility: | An applicant must be a “covered entity” to receive CHIPS Incentives. For purposes of this NOFO, a “covered entity” means a nonprofit entity; a private-sector entity; a consortium of private-sector entities; or a consortium of nonprofit, public, and private-sector entities with a demonstrated ability to substantially finance, construct, expand, or modernize a facility relating to the fabrication, assembly, testing, advanced packaging, production, or research and development of semiconductors, materials used to manufacture semiconductors or semiconductor manufacturing equipment. |
Additional Information
| Agency Name: | National Institute of Standards and Technology |
| Description: |
The CHIPS Incentives Program aims to catalyze long-term economically sustainable growth in the domestic semiconductor industry in support of U.S. economic and national security. This is the second Notice of Funding Opportunity under this program and seeks applications for projects for the construction, expansion, or modernization of commercial facilities for semiconductor materials and manufacturing equipment for which the capital investment falls below $300 million. For more information, additional resources, and instructions on how to apply, please visit chips.gov. Note that all applications must be submitted through the CHIPS Incentives Portal at https://applications.chips.gov. If you have any questions on how to apply, please email apply@chips.gov. |
| Link to Additional Information: | CHIPS Application Portal |
| Grantor Contact Information: | If you have difficulty accessing the full announcement electronically, please contact:
Misty Roosa
Management Analyst Email:apply@chips.gov |
Version History
| Version | Modification Description | Updated Date |
|---|---|---|
| Rolling NOFO | Sep 29, 2023 |
DISPLAYING: Synopsis 8
General Information
| Document Type: | Grants Notice |
| Funding Opportunity Number: | 2023-NIST-CHIPS-SMME-01 |
| Funding Opportunity Title: | CHIPS Incentives Program – Facilities for Semiconductor Materials and Manufacturing Equipment |
| Opportunity Category: | Discretionary |
| Opportunity Category Explanation: | – |
| Funding Instrument Type: | Cooperative Agreement |
| Category of Funding Activity: | Science and Technology and other Research and Development |
| Category Explanation: | – |
| Expected Number of Awards: | – |
| Assistance Listings: | 11.037 — CHIPS Incentives Program |
| Cost Sharing or Matching Requirement: | No |
| Version: | Synopsis 8 |
| Posted Date: | Sep 26, 2023 |
| Last Updated Date: | Sep 29, 2023 |
| Original Closing Date for Applications: | – Rolling NOFO |
| Current Closing Date for Applications: | – Rolling NOFO |
| Archive Date: | Mar 02, 2024 |
| Estimated Total Program Funding: | – |
| Award Ceiling: | – |
| Award Floor: | – |
Eligibility
| Eligible Applicants: | Others (see text field entitled “Additional Information on Eligibility” for clarification) |
| Additional Information on Eligibility: | An applicant must be a “covered entity” to receive CHIPS Incentives. For purposes of this NOFO, a “covered entity” means a nonprofit entity; a private-sector entity; a consortium of private-sector entities; or a consortium of nonprofit, public, and private-sector entities with a demonstrated ability to substantially finance, construct, expand, or modernize a facility relating to the fabrication, assembly, testing, advanced packaging, production, or research and development of semiconductors, materials used to manufacture semiconductors or semiconductor manufacturing equipment. |
Additional Information
| Agency Name: | National Institute of Standards and Technology |
| Description: |
The CHIPS Incentives Program aims to catalyze long-term economically sustainable growth in the domestic semiconductor industry in support of U.S. economic and national security. This is the second Notice of Funding Opportunity under this program and seeks applications for projects for the construction, expansion, or modernization of commercial facilities for semiconductor materials and manufacturing equipment for which the capital investment falls below $300 million. For more information, additional resources, and instructions on how to apply, please visit chips.gov. Note that all applications must be submitted through the CHIPS Incentives Portal at https://applications.chips.gov. If you have any questions on how to apply, please email apply@chips.gov. |
| Link to Additional Information: | CHIPS Application Portal |
| Grantor Contact Information: | If you have difficulty accessing the full announcement electronically, please contact:
Misty Roosa
Management Analyst Email:apply@chips.gov |
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