The CHIPS Research and Development Program is offering this grant to significantly advance U.S. semiconductor technology and enhance the nation’s industry competitiveness. This grant is specifically designed to support new research and development activities, with the primary purpose of establishing and accelerating robust domestic capacity for advanced packaging substrates and essential substrate materials. These components are critically important, serving as a key technology for producing sophisticated microelectronics systems. This funding opportunity, the first under the CHIPS R&D program, aims to bolster the domestic supply chain and reduce reliance on foreign sources for these vital semiconductor elements.
Opportunity ID: 352662
General Information
| Document Type: | Grants Notice |
| Funding Opportunity Number: | 2024-NIST-CHIPS-NAPMP-01 |
| Funding Opportunity Title: | FY2024 CHIPS R&D National Advanced Packaging Manufacturing Program (NAPMP) Materials & Substrates |
| Opportunity Category: | Discretionary |
| Opportunity Category Explanation: | – |
| Funding Instrument Type: | Other |
| Category of Funding Activity: | Science and Technology and other Research and Development |
| Category Explanation: | – |
| Expected Number of Awards: | – |
| Assistance Listings: | 11.042 — CHIPS Research and Development |
| Cost Sharing or Matching Requirement: | No |
| Version: | Synopsis 6 |
| Posted Date: | Feb 27, 2024 |
| Last Updated Date: | Feb 28, 2024 |
| Original Closing Date for Applications: | Jul 03, 2024 |
| Current Closing Date for Applications: | Jul 03, 2024 |
| Archive Date: | Aug 02, 2024 |
| Estimated Total Program Funding: | – |
| Award Ceiling: | – |
| Award Floor: | – |
Eligibility
| Eligible Applicants: | Others (see text field entitled “Additional Information on Eligibility” for clarification) |
| Additional Information on Eligibility: | Eligible applicants include domestic for-profit and non-profit organizations; accredited domestic institutions of higher education including community and technical colleges; and state, local, territorial, and Indian tribal governments. Eligible applicants may only submit one full application under this NOFO. Entities may not be included as subrecipients on more than two applications. |
Additional Information
| Agency Name: | National Institute of Standards and Technology |
| Description: |
The CHIPS Research and Development Program (CHIPS R&D) aims to advance the development of semiconductor technologies and to enhance the competitiveness of the U.S. semiconductor industry. This is the first Notice of Funding Opportunity under this program. It seeks applications for new research and development (R&D) activities to establish and accelerate domestic capacity for advanced packaging substrates and substrate materials, a key technology for producing microelectronics systems. |
| Link to Additional Information: | – |
| Grantor Contact Information: | If you have difficulty accessing the full announcement electronically, please contact:
Misty L Roosa
Management Analyst Email:grants@nist.gov |
Version History
| Version | Modification Description | Updated Date |
|---|---|---|
| Feb 28, 2024 |
DISPLAYING: Synopsis 6
General Information
| Document Type: | Grants Notice |
| Funding Opportunity Number: | 2024-NIST-CHIPS-NAPMP-01 |
| Funding Opportunity Title: | FY2024 CHIPS R&D National Advanced Packaging Manufacturing Program (NAPMP) Materials & Substrates |
| Opportunity Category: | Discretionary |
| Opportunity Category Explanation: | – |
| Funding Instrument Type: | Other |
| Category of Funding Activity: | Science and Technology and other Research and Development |
| Category Explanation: | – |
| Expected Number of Awards: | – |
| Assistance Listings: | 11.042 — CHIPS Research and Development |
| Cost Sharing or Matching Requirement: | No |
| Version: | Synopsis 6 |
| Posted Date: | Feb 27, 2024 |
| Last Updated Date: | Feb 28, 2024 |
| Original Closing Date for Applications: | Jul 03, 2024 |
| Current Closing Date for Applications: | Jul 03, 2024 |
| Archive Date: | Aug 02, 2024 |
| Estimated Total Program Funding: | – |
| Award Ceiling: | – |
| Award Floor: | – |
Eligibility
| Eligible Applicants: | Others (see text field entitled “Additional Information on Eligibility” for clarification) |
| Additional Information on Eligibility: | Eligible applicants include domestic for-profit and non-profit organizations; accredited domestic institutions of higher education including community and technical colleges; and state, local, territorial, and Indian tribal governments. Eligible applicants may only submit one full application under this NOFO. Entities may not be included as subrecipients on more than two applications. |
Additional Information
| Agency Name: | National Institute of Standards and Technology |
| Description: |
The CHIPS Research and Development Program (CHIPS R&D) aims to advance the development of semiconductor technologies and to enhance the competitiveness of the U.S. semiconductor industry. This is the first Notice of Funding Opportunity under this program. It seeks applications for new research and development (R&D) activities to establish and accelerate domestic capacity for advanced packaging substrates and substrate materials, a key technology for producing microelectronics systems. |
| Link to Additional Information: | – |
| Grantor Contact Information: | If you have difficulty accessing the full announcement electronically, please contact:
Misty L Roosa
Management Analyst Email:grants@nist.gov |
Related Documents
Folder 352662 Full Announcement-2024-NIST-CHIPS-NAPMP-01 -> CHIPS NAPMP MATERIALS AND SUBSTRATES NOFO.pdf
Packages
| Agency Contact Information: | Misty L Roosa Management Analyst Email: grants@nist.gov |
| Who Can Apply: | Organization Applicants |
| Assistance Listing Number | Competition ID | Competition Title | Opportunity Package ID | Opening Date | Closing Date | Actions |
|---|---|---|---|---|---|---|
| 11.042 | 2024-NIST-CHIPS-NAPMP-01 | FY2024 CHIPS R&D National Advanced Packaging Manufacturing Program (NAPMP) Materials & Substrates | PKG00285089 | Feb 28, 2024 | Jul 03, 2024 | View |
Package 1
Mandatory forms
352662 RR_SF424_5_0-5.0.pdf
352662 CD511-1.1.pdf
352662 RR_FedNonFedBudget_2_0-2.0.pdf
352662 RR_OtherProjectInfo_1_4-1.4.pdf
Optional forms
352662 SFLLL_2_0-2.0.pdf
352662 RR_FedNonFed_SubawardBudget_2_0-2.0.pdf
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