Opportunity ID: 57284

General Information

Document Type: Grants Notice
Funding Opportunity Number: DARPA-BAA-10-33
Funding Opportunity Title: Integrity and Reliability of Integrated CircuitS (IRIS)
Opportunity Category: Discretionary
Opportunity Category Explanation:
Funding Instrument Type: Cooperative Agreement
Grant
Other
Procurement Contract
Category of Funding Activity: Science and Technology and other Research and Development
Category Explanation:
Expected Number of Awards:
Assistance Listings: 12.910 — Research and Technology Development
Cost Sharing or Matching Requirement: No
Version: Synopsis 4
Posted Date: Sep 15, 2010
Last Updated Date: Nov 16, 2010
Original Closing Date for Applications: Nov 23, 2010 Important Dates:

Posting Date: September 15, 2010
Industry Day: September 28, 2010
Proposal Abstract Due Date: October 8, 2010
Proposal Due Date: November 23, 2010

Current Closing Date for Applications: Dec 17, 2010 Important Dates:

Posting Date: September 15, 2010
Industry Day: September 28, 2010
Proposal Abstract Due Date: October 14, 2010
Proposal Due Date: December 17, 2010

Archive Date: Jun 17, 2011
Estimated Total Program Funding:
Award Ceiling: $0
Award Floor: $0

Eligibility

Eligible Applicants: Unrestricted (i.e., open to any type of entity above), subject to any clarification in text field entitled “Additional Information on Eligibility”
Additional Information on Eligibility:

Additional Information

Agency Name: DARPA – Microsystems Technology Office
Description: Amendment 03: The purpose of this Amendment is to revise the Full Proposal Due Date as highlighted in yellow in the revised DARPA-BAA-10-33 document attached.

Amendment 02: The purpose of this Amendment is to revise the Application Review Information, Section 6, of the BAA as highlighted in yellow. See the revised DARPA-BAA-10-33 attached.

Amendment 01: The purpose of this amendment is to revise the abstract and proposal due dates. See the revised full DARPA-BAA-10-33 document with changes highlighted in yellow. Original synopsis below. DARPA is soliciting innovative research proposals in the area of integrated circuit (IC)analysis to determine functionality and reliability of complex integrated circuits for military applications. The objective of the Integrity and Reliability of Integrated Circuits (IRIS) program is to develop the technology to derive the functionality of an IC to determine unambiguously if malicious modifications have been made to that IC, and to accurately determine the IC’s useful lifespan from a physical perspective.See full DARPA-BAA-10-33 attached.

Link to Additional Information: MTO Solicitations page
Grantor Contact Information: If you have difficulty accessing the full announcement electronically, please contact:

BAA Coordinator
Email:DARPA-BAA-10-33@darpa.mil

Version History

Version Modification Description Updated Date
Amendment 03: The purpose of this Amendment is to revise the Full Proposal Due Date as highlighted in yellow in the revised DARPA-BAA-10-33 document attached. Nov 16, 2010
The purpose of this Amendment is to revise the Application Review Information, Section 6, of the BAA as highlighted in yellow. See the revised DARPA-BAA-10-33 attached. Nov 16, 2010
The purpose of this amendment is to revise the abstract and proposal due dates. See the revised full DARPA-BAA-10-33 document with changes highlighted in yellow. Nov 03, 2010
Oct 01, 2010

DISPLAYING: Synopsis 4

General Information

Document Type: Grants Notice
Funding Opportunity Number: DARPA-BAA-10-33
Funding Opportunity Title: Integrity and Reliability of Integrated CircuitS (IRIS)
Opportunity Category: Discretionary
Opportunity Category Explanation:
Funding Instrument Type: Cooperative Agreement
Grant
Other
Procurement Contract
Category of Funding Activity: Science and Technology and other Research and Development
Category Explanation:
Expected Number of Awards:
Assistance Listings: 12.910 — Research and Technology Development
Cost Sharing or Matching Requirement: No
Version: Synopsis 4
Posted Date: Sep 15, 2010
Last Updated Date: Nov 16, 2010
Original Closing Date for Applications: Nov 23, 2010 Important Dates:

Posting Date: September 15, 2010
Industry Day: September 28, 2010
Proposal Abstract Due Date: October 8, 2010
Proposal Due Date: November 23, 2010

Current Closing Date for Applications: Dec 17, 2010 Important Dates:

Posting Date: September 15, 2010
Industry Day: September 28, 2010
Proposal Abstract Due Date: October 14, 2010
Proposal Due Date: December 17, 2010

Archive Date: Jun 17, 2011
Estimated Total Program Funding:
Award Ceiling: $0
Award Floor: $0

Eligibility

Eligible Applicants: Unrestricted (i.e., open to any type of entity above), subject to any clarification in text field entitled “Additional Information on Eligibility”
Additional Information on Eligibility:

Additional Information

Agency Name: DARPA – Microsystems Technology Office
Description: Amendment 03: The purpose of this Amendment is to revise the Full Proposal Due Date as highlighted in yellow in the revised DARPA-BAA-10-33 document attached.

Amendment 02: The purpose of this Amendment is to revise the Application Review Information, Section 6, of the BAA as highlighted in yellow. See the revised DARPA-BAA-10-33 attached.

Amendment 01: The purpose of this amendment is to revise the abstract and proposal due dates. See the revised full DARPA-BAA-10-33 document with changes highlighted in yellow. Original synopsis below. DARPA is soliciting innovative research proposals in the area of integrated circuit (IC)analysis to determine functionality and reliability of complex integrated circuits for military applications. The objective of the Integrity and Reliability of Integrated Circuits (IRIS) program is to develop the technology to derive the functionality of an IC to determine unambiguously if malicious modifications have been made to that IC, and to accurately determine the IC’s useful lifespan from a physical perspective.See full DARPA-BAA-10-33 attached.

Link to Additional Information: MTO Solicitations page
Grantor Contact Information: If you have difficulty accessing the full announcement electronically, please contact:

BAA Coordinator
Email:DARPA-BAA-10-33@darpa.mil

DISPLAYING: Synopsis 3

General Information

Document Type: Grants Notice
Funding Opportunity Number: DARPA-BAA-10-33
Funding Opportunity Title: Integrity and Reliability of Integrated CircuitS (IRIS)
Opportunity Category: Discretionary
Opportunity Category Explanation:
Funding Instrument Type: Cooperative Agreement
Grant
Other
Procurement Contract
Category of Funding Activity: Science and Technology and other Research and Development
Category Explanation:
Expected Number of Awards:
Assistance Listings: 12.910 — Research and Technology Development
Cost Sharing or Matching Requirement: No
Version: Synopsis 3
Posted Date: Nov 16, 2010
Last Updated Date:
Original Closing Date for Applications:
Current Closing Date for Applications: Dec 07, 2010 Important Dates:

Posting Date: September 15, 2010
Industry Day: September 28, 2010
Proposal Abstract Due Date: October 14, 2010
Proposal Due Date: December 07, 2010

Archive Date: May 23, 2011
Estimated Total Program Funding:
Award Ceiling: $0
Award Floor: $0

Eligibility

Eligible Applicants: Unrestricted (i.e., open to any type of entity above), subject to any clarification in text field entitled “Additional Information on Eligibility”
Additional Information on Eligibility:

Additional Information

Agency Name: DARPA – Microsystems Technology Office
Description: Amendment 02: The purpose of this Amendment is to revise the Application Review Information, Section 6, of the BAA as highlighted in yellow. See the revised DARPA-BAA-10-33 attached.

Amendment 01: The purpose of this amendment is to revise the abstract and proposal due dates. See the revised full DARPA-BAA-10-33 document with changes highlighted in yellow. Original synopsis below. DARPA is soliciting innovative research proposals in the area of integrated circuit (IC)analysis to determine functionality and reliability of complex integrated circuits for military applications. The objective of the Integrity and Reliability of Integrated Circuits (IRIS) program is to develop the technology to derive the functionality of an IC to determine unambiguously if malicious modifications have been made to that IC, and to accurately determine the IC’s useful lifespan from a physical perspective.See full DARPA-BAA-10-33 attached.

Link to Additional Information: MTO Solicitations page
Grantor Contact Information: If you have difficulty accessing the full announcement electronically, please contact:

BAA Coordinator
Email:DARPA-BAA-10-33@darpa.mil

DISPLAYING: Synopsis 2

General Information

Document Type: Grants Notice
Funding Opportunity Number: DARPA-BAA-10-33
Funding Opportunity Title: Integrity and Reliability of Integrated CircuitS (IRIS)
Opportunity Category: Discretionary
Opportunity Category Explanation:
Funding Instrument Type: Cooperative Agreement
Grant
Other
Procurement Contract
Category of Funding Activity: Science and Technology and other Research and Development
Category Explanation:
Expected Number of Awards:
Assistance Listings: 12.910 — Research and Technology Development
Cost Sharing or Matching Requirement: No
Version: Synopsis 2
Posted Date: Nov 03, 2010
Last Updated Date:
Original Closing Date for Applications:
Current Closing Date for Applications: Dec 07, 2010 Important Dates:

Posting Date: September 15, 2010
Industry Day: September 28, 2010
Proposal Abstract Due Date: October 14, 2010
Proposal Due Date: December 07, 2010

Archive Date: May 23, 2011
Estimated Total Program Funding:
Award Ceiling: $0
Award Floor: $0

Eligibility

Eligible Applicants: Unrestricted (i.e., open to any type of entity above), subject to any clarification in text field entitled “Additional Information on Eligibility”
Additional Information on Eligibility:

Additional Information

Agency Name: DARPA – Microsystems Technology Office
Description: Amendment 01: The purpose of this amendment is to revise the abstract and proposal due dates. See the revised full DARPA-BAA-10-33 document with changes highlighted in yellow.

Original synopsis below.

DARPA is soliciting innovative research proposals in the area of integrated circuit (IC)analysis to determine functionality and reliability of complex integrated circuits for military applications. The objective of the Integrity and Reliability of Integrated Circuits (IRIS) program is to develop the technology to derive the functionality of an IC to determine unambiguously if malicious modifications have been made to that IC, and to accurately determine the IC’s useful lifespan from a physical perspective.See full DARPA-BAA-10-33 attached.

Link to Additional Information: MTO Solicitations page
Grantor Contact Information: If you have difficulty accessing the full announcement electronically, please contact:

BAA Coordinator
Email:DARPA-BAA-10-33@darpa.mil

DISPLAYING: Synopsis 1

General Information

Document Type: Grants Notice
Funding Opportunity Number: DARPA-BAA-10-33
Funding Opportunity Title: Integrity and Reliability of Integrated CircuitS (IRIS)
Opportunity Category: Discretionary
Opportunity Category Explanation:
Funding Instrument Type: Cooperative Agreement
Grant
Other
Procurement Contract
Category of Funding Activity: Science and Technology and other Research and Development
Category Explanation:
Expected Number of Awards:
Assistance Listings: 12.910 — Research and Technology Development
Cost Sharing or Matching Requirement: No
Version: Synopsis 1
Posted Date: Oct 01, 2010
Last Updated Date:
Original Closing Date for Applications:
Current Closing Date for Applications: Nov 23, 2010 Important Dates:

Posting Date: September 15, 2010
Industry Day: September 28, 2010
Proposal Abstract Due Date: October 8, 2010
Proposal Due Date: November 23, 2010

Archive Date: May 23, 2011
Estimated Total Program Funding:
Award Ceiling: $0
Award Floor: $0

Eligibility

Eligible Applicants: Unrestricted (i.e., open to any type of entity above), subject to any clarification in text field entitled “Additional Information on Eligibility”
Additional Information on Eligibility:

Additional Information

Agency Name: DARPA – Microsystems Technology Office
Description: DARPA is soliciting innovative research proposals in the area of integrated circuit (IC)analysis to determine functionality and reliability of complex integrated circuits for military applications. The objective of the Integrity and Reliability of Integrated Circuits (IRIS) program is to develop the technology to derive the functionality of an IC to determine unambiguously if malicious modifications have been made to that IC, and to accurately determine the IC’s useful lifespan from a physical perspective.

See full DARPA-BAA-10-33 attached.

Link to Additional Information: MTO Solicitations page
Grantor Contact Information: If you have difficulty accessing the full announcement electronically, please contact:

BAA Coordinator
Email:DARPA-BAA-10-33@darpa.mil

Folder 57284 Full Announcement-1 -> darpa-baa-10-33_iris_final for posting_15sep10.pdf

Folder 57284 Full Announcement-1 -> attachment_1_cost_volume_proposer_checklist_fillable.pdf

Folder 57284 Full Announcement-2 -> darpa-baa-10-33_iris_final for posting_amendment 01_1 oct 10.pdf

Folder 57284 Full Announcement-3 -> darpa-baa-10-33_iris_final for posting_amendment 02_3 nov10.pdf

Folder 57284 Full Announcement-4 -> darpa-baa-10-33_iris_final for posting_amendment 03_16nov10.pdf

Packages

Agency Contact Information: BAA Coordinator
Email: DARPA-BAA-10-33@darpa.mil
Who Can Apply: Organization Applicants

Assistance Listing Number Competition ID Competition Title Opportunity Package ID Opening Date Closing Date Actions
12.910 PKG00020984 Sep 15, 2010 Dec 17, 2010 View

Package 1

Mandatory forms

57284 RR_SF424-1.1.pdf

Optional forms

57284 RR_FedNonFedBudget-1.1.pdf

57284 RR_FedNonFed_SubawardBudget-1.2.pdf

57284 RR_OtherProjectInfo-1.1.pdf

57284 RR_Budget-1.1.pdf

57284 RR_KeyPersonExpanded-1.1.pdf

57284 RR_PerformanceSite-1.1.pdf

57284 RR_SubawardBudget-1.2.pdf

2025-07-12T07:24:57-05:00

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