Opportunity ID: 356695
General Information
| Document Type: | Grants Notice |
| Funding Opportunity Number: | HQ003425NFOEASD02 |
| Funding Opportunity Title: | SEMICONDUCTOR SUPPLY CHAIN AND CYBERSECURITY ASSESSMENT |
| Opportunity Category: | Discretionary |
| Opportunity Category Explanation: | – |
| Funding Instrument Type: | Cooperative Agreement |
| Category of Funding Activity: | Other (see text field entitled “Explanation of Other Category of Funding Activity” for clarification) |
| Category Explanation: | SEMICONDUCTOR SUPPLY CHAIN AND CYBERSECURITY ASSESSMENT |
| Expected Number of Awards: | 1 |
| Assistance Listings: | 12.599 — Congressionally Directed Assistance |
| Cost Sharing or Matching Requirement: | No |
| Version: | Synopsis 1 |
| Posted Date: | Oct 11, 2024 |
| Last Updated Date: | Oct 11, 2024 |
| Original Closing Date for Applications: | Oct 18, 2024 |
| Current Closing Date for Applications: | Oct 18, 2024 |
| Archive Date: | – |
| Estimated Total Program Funding: | – |
| Award Ceiling: | $3,000,000 |
| Award Floor: | $0 |
Eligibility
| Eligible Applicants: | Others (see text field entitled “Additional Information on Eligibility” for clarification) |
| Additional Information on Eligibility: | For the anticipated cooperative agreement, this requirement is to be negotiated exclusively with Cornell University. See (2) of the NFO document for eligibility requirements for sub-awardees or panel members. |
Additional Information
| Agency Name: | Washington Headquarters Services |
| Description: |
In recent years, the semiconductor supply chain has increasingly become a target for both nation-state actors and cybercriminals. This trend is anticipated to persist, underscoring the need for companies in the semiconductor industry to defend against a broad spectrum of sophisticated threats. The semiconductor supply chain is highly intricate, with global distribution of materials, advanced manufacturing equipment, software tools, and other capabilities. Both design and manufacturing processes involve thousands of employees operating across a worldwide network, making even minor disruptions upstream potentially cause significant ripple effects downstream. This complexity presents unique challenges in modeling and addressing cybersecurity threats.
Currently, cybersecurity efforts are focused on enhancing enterprise-wide defenses and responding to existing threats. This leaves limited capacity for organizations to anticipate and map emerging cybersecurity risks against their operations systematically. Addressing these issues is critical for the economic and national security of the United States, as well as for maintaining technological leadership. The U.S. government is making unprecedented investments in semiconductors through the CHIPS Act and other policy initiatives. Simultaneously, foreign governments are also heavily investing in their own semiconductor industries and may be seeking to undermine international competitors through cyber operations. The 2023 National Cybersecurity Strategy highlights the importance of integrating substantial cybersecurity investments with semiconductor supply chain resilience to safeguard the U.S. digital ecosystem. Forecasting cybersecurity threats specific to the semiconductor industry is urgently needed to protect the significant investments made by private stakeholders and the U.S. government in strengthening U.S. leadership in this critical sector. The Fiscal Year 2024 National Defense Authorization Act (FY24 NDAA) prescribes entering into agreements for the purpose of assessing the feasibility and advisability of improving the cybersecurity of the semiconductor supply chain. |
| Link to Additional Information: | – |
| Grantor Contact Information: | If you have difficulty accessing the full announcement electronically, please contact:
Michael J Fanizzo
Grantor Email:michael.j.fanizzo.civ@mail.mil |
Version History
| Version | Modification Description | Updated Date |
|---|---|---|
Related Documents
Packages
| Agency Contact Information: | Michael J Fanizzo Grantor Email: michael.j.fanizzo.civ@mail.mil |
| Who Can Apply: | Organization Applicants |
| Assistance Listing Number | Competition ID | Competition Title | Opportunity Package ID | Opening Date | Closing Date | Actions |
|---|---|---|---|---|---|---|
| PKG00288096 | Oct 11, 2024 | Oct 18, 2024 | View |