This DARPA grant is for the purpose of developing advanced heterogeneous integration processes. The core objective is to enable the tight integration of diverse material systems and device technologies onto a common silicon substrate. This initiative, known as the Diverse Accessible Heterogeneous Integration (DAHI) program, seeks to establish a manufacturable foundry technology. Such a foundry will provide broad accessibility to a wide community of designers, fostering innovation in cutting-edge circuit and microsystem designs. The grant aims to democratize access to advanced integration capabilities, supporting the creation of next-generation microelectronic systems and facilitating foundational research and development for a robust, accessible ecosystem in advanced microelectronics.
Opportunity ID: 160174
General Information
| Document Type: | Grants Notice |
| Funding Opportunity Number: | DARPA-BAA-12-16 |
| Funding Opportunity Title: | Diverse Accessible Heterogeneous Integration (DAHI) Foundry Technology |
| Opportunity Category: | Discretionary |
| Opportunity Category Explanation: | – |
| Funding Instrument Type: | Cooperative Agreement Grant Other Procurement Contract |
| Category of Funding Activity: | Science and Technology and other Research and Development |
| Category Explanation: | – |
| Expected Number of Awards: | – |
| Assistance Listings: | 12.910 — Research and Technology Development |
| Cost Sharing or Matching Requirement: | No |
| Version: | Synopsis 3 |
| Posted Date: | Mar 29, 2012 |
| Last Updated Date: | Jun 14, 2012 |
| Original Closing Date for Applications: | Jul 09, 2012 |
| Current Closing Date for Applications: | Jul 23, 2012 |
| Archive Date: | Jan 23, 2013 |
| Estimated Total Program Funding: | – |
| Award Ceiling: | $0 |
| Award Floor: | $0 |
Eligibility
| Eligible Applicants: | Unrestricted (i.e., open to any type of entity above), subject to any clarification in text field entitled “Additional Information on Eligibility” |
| Additional Information on Eligibility: | – |
Additional Information
| Agency Name: | DARPA – Microsystems Technology Office |
| Description: | Amendment 02: The purpose of this amendment is to revise the proposal due date as highlighted in yellow in the attached, conformed DARPA-BAA-12-16 document.
Amendment 01: The purpose of this amendment is to provide a Proposer’s Day date and the associated registration website. Original Synopsis Below. The goal of the Diverse Accessible Heterogeneous Integration (DAHI)Foundry Technology BAA is to develop advanced heterogeneous integrationprocesses, allowing diverse material systems and device technologies to be tightly integrated on a common silicon substrate. The DAHI program thrustaims to establish a manufacturable foundry technology to provide accessibility to a broad community of designers for innovative circuit or microsystem designs.See the full DARPA-BAA-12-16 document attached. |
| Link to Additional Information: | MTO Solicitations page |
| Grantor Contact Information: | If you have difficulty accessing the full announcement electronically, please contact:
Dr. Sanjay Raman
Program Manager Email:DARPA-BAA-12-16@darpa.mil |
Version History
| Version | Modification Description | Updated Date |
|---|---|---|
| Amendment 02: The purpose of this amendment is to revise the proposal due date as highlighted in yellow in the attached, conformed DARPA-BAA-12-16 document. | Jun 14, 2012 | |
| Amendment 01: The purpose of this amendment is to provide a Proposer’s Day date and the associated registration website. | Jun 14, 2012 | |
| Apr 05, 2012 |
DISPLAYING: Synopsis 3
General Information
| Document Type: | Grants Notice |
| Funding Opportunity Number: | DARPA-BAA-12-16 |
| Funding Opportunity Title: | Diverse Accessible Heterogeneous Integration (DAHI) Foundry Technology |
| Opportunity Category: | Discretionary |
| Opportunity Category Explanation: | – |
| Funding Instrument Type: | Cooperative Agreement Grant Other Procurement Contract |
| Category of Funding Activity: | Science and Technology and other Research and Development |
| Category Explanation: | – |
| Expected Number of Awards: | – |
| Assistance Listings: | 12.910 — Research and Technology Development |
| Cost Sharing or Matching Requirement: | No |
| Version: | Synopsis 3 |
| Posted Date: | Mar 29, 2012 |
| Last Updated Date: | Jun 14, 2012 |
| Original Closing Date for Applications: | Jul 09, 2012 |
| Current Closing Date for Applications: | Jul 23, 2012 |
| Archive Date: | Jan 23, 2013 |
| Estimated Total Program Funding: | – |
| Award Ceiling: | $0 |
| Award Floor: | $0 |
Eligibility
| Eligible Applicants: | Unrestricted (i.e., open to any type of entity above), subject to any clarification in text field entitled “Additional Information on Eligibility” |
| Additional Information on Eligibility: | – |
Additional Information
| Agency Name: | DARPA – Microsystems Technology Office |
| Description: | Amendment 02: The purpose of this amendment is to revise the proposal due date as highlighted in yellow in the attached, conformed DARPA-BAA-12-16 document.
Amendment 01: The purpose of this amendment is to provide a Proposer’s Day date and the associated registration website. Original Synopsis Below. The goal of the Diverse Accessible Heterogeneous Integration (DAHI)Foundry Technology BAA is to develop advanced heterogeneous integrationprocesses, allowing diverse material systems and device technologies to be tightly integrated on a common silicon substrate. The DAHI program thrustaims to establish a manufacturable foundry technology to provide accessibility to a broad community of designers for innovative circuit or microsystem designs.See the full DARPA-BAA-12-16 document attached. |
| Link to Additional Information: | MTO Solicitations page |
| Grantor Contact Information: | If you have difficulty accessing the full announcement electronically, please contact:
Dr. Sanjay Raman
Program Manager Email:DARPA-BAA-12-16@darpa.mil |
DISPLAYING: Synopsis 2
General Information
| Document Type: | Grants Notice |
| Funding Opportunity Number: | DARPA-BAA-12-16 |
| Funding Opportunity Title: | Diverse Accessible Heterogeneous Integration (DAHI) Foundry Technology |
| Opportunity Category: | Discretionary |
| Opportunity Category Explanation: | – |
| Funding Instrument Type: | Cooperative Agreement Grant Other Procurement Contract |
| Category of Funding Activity: | Science and Technology and other Research and Development |
| Category Explanation: | – |
| Expected Number of Awards: | – |
| Assistance Listings: | 12.910 — Research and Technology Development |
| Cost Sharing or Matching Requirement: | No |
| Version: | Synopsis 2 |
| Posted Date: | Jun 14, 2012 |
| Last Updated Date: | – |
| Original Closing Date for Applications: | – |
| Current Closing Date for Applications: | Jul 09, 2012 |
| Archive Date: | Jan 09, 2013 |
| Estimated Total Program Funding: | – |
| Award Ceiling: | $0 |
| Award Floor: | $0 |
Eligibility
| Eligible Applicants: | Unrestricted (i.e., open to any type of entity above), subject to any clarification in text field entitled “Additional Information on Eligibility” |
| Additional Information on Eligibility: | – |
Additional Information
| Agency Name: | DARPA – Microsystems Technology Office |
| Description: | Amendment 01: The purpose of this amendment is to provide a Proposer’s Day date and the associated registration website.
Original Synopsis Below. |
| Link to Additional Information: | MTO Solicitations page |
| Grantor Contact Information: | If you have difficulty accessing the full announcement electronically, please contact:
Dr. Sanjay Raman
Program Manager Email:DARPA-BAA-12-16@darpa.mil |
DISPLAYING: Synopsis 1
General Information
| Document Type: | Grants Notice |
| Funding Opportunity Number: | DARPA-BAA-12-16 |
| Funding Opportunity Title: | Diverse Accessible Heterogeneous Integration (DAHI) Foundry Technology |
| Opportunity Category: | Discretionary |
| Opportunity Category Explanation: | – |
| Funding Instrument Type: | Cooperative Agreement Grant Other Procurement Contract |
| Category of Funding Activity: | Science and Technology and other Research and Development |
| Category Explanation: | – |
| Expected Number of Awards: | – |
| Assistance Listings: | 12.910 — Research and Technology Development |
| Cost Sharing or Matching Requirement: | No |
| Version: | Synopsis 1 |
| Posted Date: | Apr 05, 2012 |
| Last Updated Date: | – |
| Original Closing Date for Applications: | – |
| Current Closing Date for Applications: | Jul 09, 2012 |
| Archive Date: | Jan 09, 2013 |
| Estimated Total Program Funding: | – |
| Award Ceiling: | $0 |
| Award Floor: | $0 |
Eligibility
| Eligible Applicants: | Unrestricted (i.e., open to any type of entity above), subject to any clarification in text field entitled “Additional Information on Eligibility” |
| Additional Information on Eligibility: | – |
Additional Information
| Agency Name: | DARPA – Microsystems Technology Office |
| Description: | The goal of the Diverse Accessible Heterogeneous Integration (DAHI)Foundry Technology BAA is to develop advanced heterogeneous integration processes, allowing diverse material systems and device technologies to be tightly integrated on a common silicon substrate. The DAHI program thrust aims to establish a manufacturable foundry technology to provide accessibility to a broad community of designers for innovative circuit or microsystem designs. See the full DARPA-BAA-12-16 document attached. |
| Link to Additional Information: | MTO Solicitations page |
| Grantor Contact Information: | If you have difficulty accessing the full announcement electronically, please contact:
Dr. Sanjay Raman
Program Manager Email:DARPA-BAA-12-16@darpa.mil |
Related Documents
Folder 160174 Full Announcement-1 -> darpa-baa-12-16_dahi_final for posting_29march12.pdf
Folder 160174 Full Announcement-1 -> attachment_1_cost_volume_proposer_checklist.pdf
Folder 160174 Full Announcement-2 -> darpa-baa-12-16_dahi_final for posting_amendment 01_5 april 12.pdf
Folder 160174 Full Announcement-3 -> darpa-baa-12-16_dahi_final for posting_amendment 02_14june12.pdf
Packages
| Agency Contact Information: | Dr. Sanjay Raman Program Manager Email: DARPA-BAA-12-16@darpa.mil |
| Who Can Apply: | Organization Applicants |
| Assistance Listing Number | Competition ID | Competition Title | Opportunity Package ID | Opening Date | Closing Date | Actions |
|---|---|---|---|---|---|---|
| 12.910 | PKG00112551 | Mar 29, 2012 | Jul 23, 2012 | View |
Package 1
Mandatory forms
160174 RR_SF424_1_2-1.2.pdf
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