This DARPA grant is for the development and demonstration of innovative active cooling modules (ACM) to address critical heat rejection limitations in high-performance Department of Defense (DoD) systems. As DoD systems demand increased performance and reduced size, their power consumption rises, making efficient thermal management crucial. DARPA seeks research proposals focused on novel materials and structures capable of providing significant cooling (tens of degrees) for 100W devices within compact, cm-scale cooling modules. A key objective is achieving a Coefficient of Performance (COP) of 3 or better, enabling advanced thermal solutions vital for maintaining optimal operation of next-generation DoD technologies.
Opportunity ID: 46985
General Information
| Document Type: | Grants Notice |
| Funding Opportunity Number: | DARPA-BAA-09-44 |
| Funding Opportunity Title: | Active Cooling Modules (ACM) |
| Opportunity Category: | Discretionary |
| Opportunity Category Explanation: | – |
| Funding Instrument Type: | Cooperative Agreement Grant Other Procurement Contract |
| Category of Funding Activity: | Science and Technology and other Research and Development |
| Category Explanation: | – |
| Expected Number of Awards: | – |
| Assistance Listings: | 12.910 — Research and Technology Development |
| Cost Sharing or Matching Requirement: | No |
| Version: | Synopsis 1 |
| Posted Date: | Apr 23, 2009 |
| Last Updated Date: | – |
| Original Closing Date for Applications: | Apr 22, 2010 Dates Posting Date: April 23, 2009 Abstract Due Date: June 18, 2009, 12:00 PM, Eastern Time First Round Proposal Due Date: August 13, 2009, 12:00 PM, Eastern Time |
| Current Closing Date for Applications: | Apr 22, 2010 Dates Posting Date: April 23, 2009 Abstract Due Date: June 18, 2009, 12:00 PM, Eastern Time First Round Proposal Due Date: August 13, 2009, 12:00 PM, Eastern Time |
| Archive Date: | May 14, 2010 |
| Estimated Total Program Funding: | – |
| Award Ceiling: | $0 |
| Award Floor: | $0 |
Eligibility
| Eligible Applicants: | Unrestricted (i.e., open to any type of entity above), subject to any clarification in text field entitled “Additional Information on Eligibility” |
| Additional Information on Eligibility: | – |
Additional Information
| Agency Name: | DARPA – Microsystems Technology Office |
| Description: | DARPA is soliciting innovative research proposals in the area of active cooling modules. DoD systems are driving conflicting needs for high performance as well as reduced size and weight. DARPA makes many investments in new technologies that can improve performance or reduce size and weight. Unfortunately, in many cases, the power consumption of these systems increases with each improvement. As a result, the performance of heat rejection technology remains a key limitation in many applications.
The primary goal of this program is the development and demonstration of ideas based on novel materials and structures that can provide tens of degrees of cooling for 100W devices in cm-scale cooling modules with coefficient of performance (COP) of 3 or better. All administrative correspondence and questions on this solicitation, including requests for information on how to submit a proposal abstract or full proposal to this BAA, should be directed to one of the administrative addresses below; e-mail or fax is preferred. E-mail: DARPA-BAA-09-44@darpa.mil; PHONE: (703) 351-8427 for administrative/TFIMS questions; PHONE: (703) 351-8573 for technical questions. DARPA intends to use electronic mail for correspondence regarding DARPA-BAA-09-44. See the full BAA document attached. |
| Link to Additional Information: | MTO Solicitations Page |
| Grantor Contact Information: | If you have difficulty accessing the full announcement electronically, please contact:
Dr. Thomas Kenny, Program Manager
DARPA/MTO ATTN: DARPA-BAA-09-44 3701 North Fairfax Drive Arlington, VA 22203-1714 Email:DARPA-BAA-09-44@darpa.mil |
Version History
| Version | Modification Description | Updated Date |
|---|---|---|
Related Documents
Folder 46985 Full Announcement-1 -> darpa-baa-09-44_acm_final for posting_23apr09.pdf
Packages
| Agency Contact Information: | Dr. Thomas Kenny, Program Manager DARPA/MTO ATTN: DARPA-BAA-09-44 3701 North Fairfax Drive Arlington, VA 22203-1714 Email: DARPA-BAA-09-44@darpa.mil |
| Who Can Apply: | Organization Applicants |
| Assistance Listing Number | Competition ID | Competition Title | Opportunity Package ID | Opening Date | Closing Date | Actions |
|---|---|---|---|---|---|---|
| 12.910 | PKG00011789 | Apr 23, 2009 | Apr 22, 2010 | View |
Package 1
Mandatory forms
46985 RR_SF424-1.1.pdf
Optional forms
46985 RR_FedNonFedBudget-1.1.pdf
46985 RR_FedNonFed_SubawardBudget-1.2.pdf
46985 RR_OtherProjectInfo-1.1.pdf
46985 RR_Budget-1.1.pdf
46985 RR_KeyPersonExpanded-1.1.pdf
46985 RR_PerformanceSite-1.1.pdf
46985 RR_SubawardBudget-1.2.pdf
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