Opportunity ID: 219415
General Information
| Document Type: | Grants Notice |
| Funding Opportunity Number: | DARPA-BAA-13-21 |
| Funding Opportunity Title: | ICECool Applications (ICECool Apps) |
| Opportunity Category: | Discretionary |
| Opportunity Category Explanation: | – |
| Funding Instrument Type: | Cooperative Agreement Grant Other Procurement Contract |
| Category of Funding Activity: | Science and Technology and other Research and Development |
| Category Explanation: | – |
| Expected Number of Awards: | – |
| Assistance Listings: | 12.910 — Research and Technology Development |
| Cost Sharing or Matching Requirement: | No |
| Version: | Synopsis 2 |
| Posted Date: | Feb 06, 2013 |
| Last Updated Date: | Feb 12, 2013 |
| Original Closing Date for Applications: | Mar 22, 2013 |
| Current Closing Date for Applications: | Mar 22, 2013 |
| Archive Date: | Sep 23, 2013 |
| Estimated Total Program Funding: | – |
| Award Ceiling: | $0 |
| Award Floor: | $0 |
Eligibility
| Eligible Applicants: | Unrestricted (i.e., open to any type of entity above), subject to any clarification in text field entitled “Additional Information on Eligibility” |
| Additional Information on Eligibility: | – |
Additional Information
| Agency Name: | DARPA – Microsystems Technology Office |
| Description: | Amendment 01: The purpose of this amendment is to:
1. Revise/Correct HEMT hot spot flux metric depicted throughout the BAA primarily in Table 1 and Table 2. All changes are highlighted in yellow in the attached conformed DARPA-BAA-13-21 document. Original synopsis below. ICECool is exploring disruptive thermal technologies that will mitigate thermal limitations on the operation of military electronic systems, while significantly reducing size, weight, and power consumption (SWaP). The specific goal of ICECool Applications is to enhance the performance of RF power amplifiers and embedded computing systems through the application of chip-level heat removal with kW-level heat flux and heat density with thermal control of local submillimeter hot spots, while maintaining these components in their commonly-accepted temperature range by judicious combination of intra- and/or interchip microfluidic cooling and on-chip thermal interconnects.See the full DARPA-BAA-13-21 document attached. |
| Link to Additional Information: | MTO Solicitations Page |
| Grantor Contact Information: | If you have difficulty accessing the full announcement electronically, please contact:
Dr. Avram Bar-Cohen
Program Manager DARPA/MTO Email:DARPA-BAA-13-21@darpa.mil |
Version History
| Version | Modification Description | Updated Date |
|---|---|---|
| The purpose of this amendment is to: 1. Revise/Correct “HEMT “hot spot” flux metric depicted throughout the BAA – primarily in Table 1 and Table 2. 2. Effect administrative/wording revisions. 3. Delete Attachment 1 and replace with a new Attachment 1 (Cost Proposal Checklist). |
Feb 12, 2013 | |
| Feb 12, 2013 |
DISPLAYING: Synopsis 2
General Information
| Document Type: | Grants Notice |
| Funding Opportunity Number: | DARPA-BAA-13-21 |
| Funding Opportunity Title: | ICECool Applications (ICECool Apps) |
| Opportunity Category: | Discretionary |
| Opportunity Category Explanation: | – |
| Funding Instrument Type: | Cooperative Agreement Grant Other Procurement Contract |
| Category of Funding Activity: | Science and Technology and other Research and Development |
| Category Explanation: | – |
| Expected Number of Awards: | – |
| Assistance Listings: | 12.910 — Research and Technology Development |
| Cost Sharing or Matching Requirement: | No |
| Version: | Synopsis 2 |
| Posted Date: | Feb 06, 2013 |
| Last Updated Date: | Feb 12, 2013 |
| Original Closing Date for Applications: | Mar 22, 2013 |
| Current Closing Date for Applications: | Mar 22, 2013 |
| Archive Date: | Sep 23, 2013 |
| Estimated Total Program Funding: | – |
| Award Ceiling: | $0 |
| Award Floor: | $0 |
Eligibility
| Eligible Applicants: | Unrestricted (i.e., open to any type of entity above), subject to any clarification in text field entitled “Additional Information on Eligibility” |
| Additional Information on Eligibility: | – |
Additional Information
| Agency Name: | DARPA – Microsystems Technology Office |
| Description: | Amendment 01: The purpose of this amendment is to:
1. Revise/Correct HEMT hot spot flux metric depicted throughout the BAA primarily in Table 1 and Table 2. All changes are highlighted in yellow in the attached conformed DARPA-BAA-13-21 document. Original synopsis below. ICECool is exploring disruptive thermal technologies that will mitigate thermal limitations on the operation of military electronic systems, while significantly reducing size, weight, and power consumption (SWaP). The specific goal of ICECool Applications is to enhance the performance of RF power amplifiers and embedded computing systems through the application of chip-level heat removal with kW-level heat flux and heat density with thermal control of local submillimeter hot spots, while maintaining these components in their commonly-accepted temperature range by judicious combination of intra- and/or interchip microfluidic cooling and on-chip thermal interconnects.See the full DARPA-BAA-13-21 document attached. |
| Link to Additional Information: | MTO Solicitations Page |
| Grantor Contact Information: | If you have difficulty accessing the full announcement electronically, please contact:
Dr. Avram Bar-Cohen
Program Manager DARPA/MTO Email:DARPA-BAA-13-21@darpa.mil |
DISPLAYING: Synopsis 1
General Information
| Document Type: | Grants Notice |
| Funding Opportunity Number: | DARPA-BAA-13-21 |
| Funding Opportunity Title: | ICECool Applications (ICECool Apps) |
| Opportunity Category: | Discretionary |
| Opportunity Category Explanation: | – |
| Funding Instrument Type: | Cooperative Agreement Grant Other Procurement Contract |
| Category of Funding Activity: | Science and Technology and other Research and Development |
| Category Explanation: | – |
| Expected Number of Awards: | – |
| Assistance Listings: | 12.910 — Research and Technology Development |
| Cost Sharing or Matching Requirement: | No |
| Version: | Synopsis 1 |
| Posted Date: | Feb 12, 2013 |
| Last Updated Date: | – |
| Original Closing Date for Applications: | – |
| Current Closing Date for Applications: | Mar 22, 2013 |
| Archive Date: | Sep 23, 2013 |
| Estimated Total Program Funding: | – |
| Award Ceiling: | $0 |
| Award Floor: | $0 |
Eligibility
| Eligible Applicants: | Unrestricted (i.e., open to any type of entity above), subject to any clarification in text field entitled “Additional Information on Eligibility” |
| Additional Information on Eligibility: | – |
Additional Information
| Agency Name: | DARPA – Microsystems Technology Office |
| Description: | ICECool is exploring disruptive thermal technologies that will mitigate thermal limitations on the operation of military electronic systems, while significantly reducing size, weight, and power consumption (SWaP). The specific goal of ICECool Applications is to enhance the performance of RF power amplifiers and embedded computing systems through the application of chip-level heat removal with kW-level heat flux and heat density with thermal control of local submillimeter hot spots, while maintaining these components in their commonly-accepted temperature range by judicious combination of intra- and/or interchip microfluidic cooling and on-chip thermal interconnects.
See the full DARPA-BAA-13-21 document attached. |
| Link to Additional Information: | MTO Solicitations Page |
| Grantor Contact Information: | If you have difficulty accessing the full announcement electronically, please contact:
Dr. Avram Bar-Cohen
Program Manager DARPA/MTO Email:DARPA-BAA-13-21@darpa.mil |
Related Documents
Packages
| Agency Contact Information: | Dr. Avram Bar-Cohen Program Manager DARPA/MTO Email: DARPA-BAA-13-21@darpa.mil |
| Who Can Apply: | Organization Applicants |
| Assistance Listing Number | Competition ID | Competition Title | Opportunity Package ID | Opening Date | Closing Date | Actions |
|---|---|---|---|---|---|---|
| 12.910 | PKG00163651 | Feb 06, 2013 | Mar 22, 2013 | View |
Package 1
Mandatory forms
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