Opportunity ID: 355148
General Information
| Document Type: | Grants Notice |
| Funding Opportunity Number: | OFOP0001480 |
| Funding Opportunity Title: | Printed Circuit Boards (PCB) Workforce Development Program |
| Opportunity Category: | Discretionary |
| Opportunity Category Explanation: | – |
| Funding Instrument Type: | Grant |
| Category of Funding Activity: | Other (see text field entitled “Explanation of Other Category of Funding Activity” for clarification) |
| Category Explanation: | Economic Development |
| Expected Number of Awards: | 1 |
| Assistance Listings: | 19.750 — Bureau of Western Hemisphere Affairs (WHA) Grant Programs (including Energy and Climate Partnership for the Americas) |
| Cost Sharing or Matching Requirement: | No |
| Version: | Synopsis 2 |
| Posted Date: | Jun 26, 2024 |
| Last Updated Date: | Jul 19, 2024 |
| Original Closing Date for Applications: | Jul 31, 2024 |
| Current Closing Date for Applications: | Aug 02, 2024 |
| Archive Date: | – |
| Estimated Total Program Funding: | $250,000 |
| Award Ceiling: | $250,000 |
| Award Floor: | $250,000 |
Eligibility
| Eligible Applicants: | Others (see text field entitled “Additional Information on Eligibility” for clarification) |
| Additional Information on Eligibility: | U.S.-based non-profit/non-governmental organizations; U.S. public organizations; U.S.-based educational institutions; U.S.-based for profit organizations or businesses. Mexico-based non-profit/non-governmental organizations; Mexican public organizations; Mexico-based educational institutions; Mexico-based for-profit organizations or businesses. Taiwan-based educational institutions, private non-profit organizations, or for-profit organizations or businesses may participate as sub-awardees. |
Additional Information
| Agency Name: | U.S. Mission to Mexico |
| Description: |
U.S. Embassy Mexico City of the U.S. Department of State announces an open competition for organizations to submit applications to carry out a program to promote workforce development in the printed circuit board (PCB) industry through curriculum development for PCB focused courses at secondary and tertiary educational levels, certificate programs, vocational instruction, dual education, technical English language skills building, and full or partial support for internships in Taiwanese PCB manufacturing firms either in Taiwan or Mexico. |
| Link to Additional Information: | Link to Opportunity in MyGrants |
| Grantor Contact Information: | If you have difficulty accessing the full announcement electronically, please contact:
Mission Mexico Economic Section Grants Management Team
Email:mexicoecongrants1@state.gov |
Version History
| Version | Modification Description | Updated Date |
|---|---|---|
| NOFO modified to include U.S.-based organizations and to include an extended deadline | Jul 19, 2024 | |
| Jun 26, 2024 |
DISPLAYING: Synopsis 2
General Information
| Document Type: | Grants Notice |
| Funding Opportunity Number: | OFOP0001480 |
| Funding Opportunity Title: | Printed Circuit Boards (PCB) Workforce Development Program |
| Opportunity Category: | Discretionary |
| Opportunity Category Explanation: | – |
| Funding Instrument Type: | Grant |
| Category of Funding Activity: | Other (see text field entitled “Explanation of Other Category of Funding Activity” for clarification) |
| Category Explanation: | Economic Development |
| Expected Number of Awards: | 1 |
| Assistance Listings: | 19.750 — Bureau of Western Hemisphere Affairs (WHA) Grant Programs (including Energy and Climate Partnership for the Americas) |
| Cost Sharing or Matching Requirement: | No |
| Version: | Synopsis 2 |
| Posted Date: | Jun 26, 2024 |
| Last Updated Date: | Jul 19, 2024 |
| Original Closing Date for Applications: | Jul 31, 2024 |
| Current Closing Date for Applications: | Aug 02, 2024 |
| Archive Date: | – |
| Estimated Total Program Funding: | $250,000 |
| Award Ceiling: | $250,000 |
| Award Floor: | $250,000 |
Eligibility
| Eligible Applicants: | Others (see text field entitled “Additional Information on Eligibility” for clarification) |
| Additional Information on Eligibility: | U.S.-based non-profit/non-governmental organizations; U.S. public organizations; U.S.-based educational institutions; U.S.-based for profit organizations or businesses. Mexico-based non-profit/non-governmental organizations; Mexican public organizations; Mexico-based educational institutions; Mexico-based for-profit organizations or businesses. Taiwan-based educational institutions, private non-profit organizations, or for-profit organizations or businesses may participate as sub-awardees. |
Additional Information
| Agency Name: | U.S. Mission to Mexico |
| Description: |
U.S. Embassy Mexico City of the U.S. Department of State announces an open competition for organizations to submit applications to carry out a program to promote workforce development in the printed circuit board (PCB) industry through curriculum development for PCB focused courses at secondary and tertiary educational levels, certificate programs, vocational instruction, dual education, technical English language skills building, and full or partial support for internships in Taiwanese PCB manufacturing firms either in Taiwan or Mexico. |
| Link to Additional Information: | Link to Opportunity in MyGrants |
| Grantor Contact Information: | If you have difficulty accessing the full announcement electronically, please contact:
Mission Mexico Economic Section Grants Management Team
Email:mexicoecongrants1@state.gov |
DISPLAYING: Synopsis 1
General Information
| Document Type: | Grants Notice |
| Funding Opportunity Number: | OFOP0001480 |
| Funding Opportunity Title: | Printed Circuit Boards (PCB) Workforce Development Program |
| Opportunity Category: | Discretionary |
| Opportunity Category Explanation: | – |
| Funding Instrument Type: | Grant |
| Category of Funding Activity: | Other (see text field entitled “Explanation of Other Category of Funding Activity” for clarification) |
| Category Explanation: | Economic Development |
| Expected Number of Awards: | 1 |
| Assistance Listings: | 19.750 — Bureau of Western Hemisphere Affairs (WHA) Grant Programs (including Energy and Climate Partnership for the Americas) |
| Cost Sharing or Matching Requirement: | No |
| Version: | Synopsis 1 |
| Posted Date: | Jun 26, 2024 |
| Last Updated Date: | Jun 26, 2024 |
| Original Closing Date for Applications: | – |
| Current Closing Date for Applications: | Jul 31, 2024 |
| Archive Date: | – |
| Estimated Total Program Funding: | $250,000 |
| Award Ceiling: | $250,000 |
| Award Floor: | $250,000 |
Eligibility
| Eligible Applicants: | Others (see text field entitled “Additional Information on Eligibility” for clarification) |
| Additional Information on Eligibility: | Mexico based non profit or non governmental organizations; Mexican public organizations; Mexico based educational institutions; Mexico based for profit organizations or businesses. Taiwan based educational institutions, private non-profit organizations, or for profit organizations or businesses may participate as sub awardees. |
Additional Information
| Agency Name: | U.S. Mission to Mexico |
| Description: | U.S. Embassy Mexico City of the U.S. Department of State announces an open competition for organizations to submit applications to carry out a program to promote workforce development in the printed circuit board (PCB) industry through curriculum development for PCB focused courses at secondary and tertiary educational levels, certificate programs, vocational instruction, dual education, technical English language skills building, and full or partial support for internships in Taiwanese PCB manufacturing firms either in Taiwan or Mexico. |
| Link to Additional Information: | Link to Opportunity in MyGrants |
| Grantor Contact Information: | If you have difficulty accessing the full announcement electronically, please contact:
mexicoecongrants1@state.gov
Email:- |
Related Documents
Packages
| Agency Contact Information: | Mission Mexico Economic Section Grants Management Team Email: mexicoecongrants1@state.gov |
| Who Can Apply: | Organization Applicants |
| Assistance Listing Number | Competition ID | Competition Title | Opportunity Package ID | Opening Date | Closing Date | Actions |
|---|---|---|---|---|---|---|
| 19.750 | OFOP0001480 | Printed Circuit Boards (PCB) Workforce Development Program | PKG00287196 | Jun 26, 2024 | Aug 02, 2024 | View |