In a bid to bolster the United States’ semiconductor sector, the National Institute of Standards and Technology (NIST) has announced a groundbreaking funding opportunity. Dubbed the FY2024 CHIPS R&D National Advanced Packaging Manufacturing Program (NAPMP) Materials & Substrates, this initiative targets the advancement of semiconductor technologies. The program, unveiled on February 28, 2024, marks a significant stride in enhancing the competitiveness of the U.S. semiconductor industry. Under this opportunity, domestic for-profit and non-profit organizations, accredited institutions of higher education, and various governmental entities are invited to submit proposals aimed at establishing and accelerating domestic capacity for advanced packaging substrates and substrate materials. This funding initiative is the inaugural Notice of Funding Opportunity (NOFO) launched under the CHIPS Research and Development Program (CHIPS R&D). With an original closing date set for July 3, 2024, interested parties are encouraged to seize this opportunity to contribute to the nation’s microelectronics ecosystem.
Opportunity ID: 352662
General Information
| Document Type: | Grants Notice |
| Funding Opportunity Number: | 2024-NIST-CHIPS-NAPMP-01 |
| Funding Opportunity Title: | FY2024 CHIPS R&D National Advanced Packaging Manufacturing Program (NAPMP) Materials & Substrates |
| Opportunity Category: | Discretionary |
| Opportunity Category Explanation: | |
| Funding Instrument Type: | Other |
| Category of Funding Activity: | Science and Technology and other Research and Development |
| Category Explanation: | |
| Expected Number of Awards: | |
| CFDA Number(s): | 11.042 — CHIPS Research and Development |
| Cost Sharing or Matching Requirement: | No |
| Version: | Synopsis 6 |
| Posted Date: | Feb 28, 2024 |
| Last Updated Date: | Feb 28, 2024 |
| Original Closing Date for Applications: | Jul 03, 2024 |
| Current Closing Date for Applications: | Jul 03, 2024 |
| Archive Date: | Aug 02, 2024 |
| Estimated Total Program Funding: | |
| Award Ceiling: | $ |
| Award Floor: | $ |
Eligibility
| Eligible Applicants: | Others (see text field entitled “Additional Information on Eligibility” for clarification) |
| Additional Information on Eligibility: | Eligible applicants include domestic for-profit and non-profit organizations; accredited domestic institutions of higher education including community and technical colleges; and state, local, territorial, and Indian tribal governments. Eligible applicants may only submit one full application under this NOFO. Entities may not be included as subrecipients on more than two applications. |
Additional Information
| Agency Name: | National Institute of Standards and Technology |
| Description: | The CHIPS Research and Development Program (CHIPS R&D) aims to advance the development of semiconductor technologies and to enhance the competitiveness of the U.S. semiconductor industry. This is the first Notice of Funding Opportunity under this program. It seeks applications for new research and development (R&D) activities to establish and accelerate domestic capacity for advanced packaging substrates and substrate materials, a key technology for producing microelectronics systems. |
| Link to Additional Information: | |
| Grantor Contact Information: | If you have difficulty accessing the full announcement electronically, please contact: Misty L Roosa
Management Analyst |
Packages
| Assistance Listings | Competition ID | Competition Title | Opportunity Package ID | Opening Date | Closing Date | Actions | Who Can Apply: | |
|---|---|---|---|---|---|---|---|---|
| 11.042 | 2024-NIST-CHIPS-NAPMP-01 | FY2024 CHIPS R&D National Advanced Packaging Manufacturing Program (NAPMP) Materials & Substrates | PKG00285089 | Feb 28, 2024 | Jul 03, 2024 | View | Misty Roosa | Organization Applicants |
Packages
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