This grant, offered by the Next-Generation Microelectronics Manufacturing (NGMM) program, is designed to establish a domestic center for research, development, and manufacturing of three-dimensional heterogeneous integration (3DHI) microsystems. The NGMM program will unfold in three distinct phases. The current solicitation (Phase 0) focuses on critical foundational research to inform the detailed planning of the future 3DHI manufacturing center. This includes defining exemplar 3DHI microsystems and meticulously identifying the essential equipment, process, and facility requirements needed for their production. The subsequent establishment of the full-scale 3DHI manufacturing center itself will be outlined in a separate, future solicitation. This initiative aims to bolster domestic microelectronics capabilities.
Opportunity ID: 342998
General Information
| Document Type: | Grants Notice |
| Funding Opportunity Number: | HR001122S0050 |
| Funding Opportunity Title: | Next-Generation Microelectronics Manufacturing (NGMM) |
| Opportunity Category: | Discretionary |
| Opportunity Category Explanation: | – |
| Funding Instrument Type: | Cooperative Agreement Grant Other Procurement Contract |
| Category of Funding Activity: | Science and Technology and other Research and Development |
| Category Explanation: | – |
| Expected Number of Awards: | – |
| Assistance Listings: | 12.910 — Research and Technology Development |
| Cost Sharing or Matching Requirement: | No |
| Version: | Synopsis 3 |
| Posted Date: | Aug 05, 2022 |
| Last Updated Date: | Oct 03, 2022 |
| Original Closing Date for Applications: | Sep 21, 2022 See Full Announcement for details. |
| Current Closing Date for Applications: | Oct 12, 2022 See Full Announcement for details. |
| Archive Date: | Mar 05, 2023 |
| Estimated Total Program Funding: | – |
| Award Ceiling: | – |
| Award Floor: | – |
Eligibility
| Eligible Applicants: | Others (see text field entitled “Additional Information on Eligibility” for clarification) |
| Additional Information on Eligibility: | All responsible sources capable of satisfying the Government’s needs may submit a proposal that shall be considered by DARPA. See the Eligibility Information section of the BAA for more information. |
Additional Information
| Agency Name: | DARPA – Microsystems Technology Office |
| Description: | Amendment 02 – The purpose of this amendment is to extend the Full Proposal Due Date to October 12, 2022.
The NGMM program will establish a domestic center for R&D and manufacturing 3DHI (three-dimensional heterogeneous integration) microsystems through a subsequent Program Solicitation. The NGMM program will consist of three phases. Phase 0 research for this program (solicited through this HR001122S0050 BAA) will inform planning for the 3DHI manufacturing center by defining exemplar 3DHI microsystems and identifying the equipment, process, and facility requirements for manufacturing these microsystems. The NGMM program plans to establish the 3DHI manufacturing center through a separate, future solicitation. |
| Link to Additional Information: | SAM.gov Contract Opportunities |
| Grantor Contact Information: | If you have difficulty accessing the full announcement electronically, please contact:
BAA Coordinator
HR001122S0050@darpa.mil Email:HR001122S0050@darpa.mil |
Version History
| Version | Modification Description | Updated Date |
|---|---|---|
| The purpose of this amendment is to extend the Full Proposal Due Date to October 12, 2022. | Oct 03, 2022 | |
| The purpose of this amendment is to extend the FAQ Submission Deadline and Full Proposal Due Date. | Aug 05, 2022 | |
| Aug 05, 2022 |
DISPLAYING: Synopsis 3
General Information
| Document Type: | Grants Notice |
| Funding Opportunity Number: | HR001122S0050 |
| Funding Opportunity Title: | Next-Generation Microelectronics Manufacturing (NGMM) |
| Opportunity Category: | Discretionary |
| Opportunity Category Explanation: | – |
| Funding Instrument Type: | Cooperative Agreement Grant Other Procurement Contract |
| Category of Funding Activity: | Science and Technology and other Research and Development |
| Category Explanation: | – |
| Expected Number of Awards: | – |
| Assistance Listings: | 12.910 — Research and Technology Development |
| Cost Sharing or Matching Requirement: | No |
| Version: | Synopsis 3 |
| Posted Date: | Aug 05, 2022 |
| Last Updated Date: | Oct 03, 2022 |
| Original Closing Date for Applications: | Sep 21, 2022 See Full Announcement for details. |
| Current Closing Date for Applications: | Oct 12, 2022 See Full Announcement for details. |
| Archive Date: | Mar 05, 2023 |
| Estimated Total Program Funding: | – |
| Award Ceiling: | – |
| Award Floor: | – |
Eligibility
| Eligible Applicants: | Others (see text field entitled “Additional Information on Eligibility” for clarification) |
| Additional Information on Eligibility: | All responsible sources capable of satisfying the Government’s needs may submit a proposal that shall be considered by DARPA. See the Eligibility Information section of the BAA for more information. |
Additional Information
| Agency Name: | DARPA – Microsystems Technology Office |
| Description: | Amendment 02 – The purpose of this amendment is to extend the Full Proposal Due Date to October 12, 2022.
The NGMM program will establish a domestic center for R&D and manufacturing 3DHI (three-dimensional heterogeneous integration) microsystems through a subsequent Program Solicitation. The NGMM program will consist of three phases. Phase 0 research for this program (solicited through this HR001122S0050 BAA) will inform planning for the 3DHI manufacturing center by defining exemplar 3DHI microsystems and identifying the equipment, process, and facility requirements for manufacturing these microsystems. The NGMM program plans to establish the 3DHI manufacturing center through a separate, future solicitation. |
| Link to Additional Information: | SAM.gov Contract Opportunities |
| Grantor Contact Information: | If you have difficulty accessing the full announcement electronically, please contact:
BAA Coordinator
HR001122S0050@darpa.mil Email:HR001122S0050@darpa.mil |
DISPLAYING: Synopsis 2
General Information
| Document Type: | Grants Notice |
| Funding Opportunity Number: | HR001122S0050 |
| Funding Opportunity Title: | Next-Generation Microelectronics Manufacturing (NGMM) |
| Opportunity Category: | Discretionary |
| Opportunity Category Explanation: | – |
| Funding Instrument Type: | Cooperative Agreement Grant Other Procurement Contract |
| Category of Funding Activity: | Science and Technology and other Research and Development |
| Category Explanation: | – |
| Expected Number of Awards: | – |
| Assistance Listings: | 12.910 — Research and Technology Development |
| Cost Sharing or Matching Requirement: | No |
| Version: | Synopsis 2 |
| Posted Date: | Aug 05, 2022 |
| Last Updated Date: | Aug 30, 2022 |
| Original Closing Date for Applications: | – |
| Current Closing Date for Applications: | Oct 05, 2022 See Full Announcement for details. |
| Archive Date: | Mar 05, 2023 |
| Estimated Total Program Funding: | – |
| Award Ceiling: | – |
| Award Floor: | – |
Eligibility
| Eligible Applicants: | Others (see text field entitled “Additional Information on Eligibility” for clarification) |
| Additional Information on Eligibility: | All responsible sources capable of satisfying the Government’s needs may submit a proposal that shall be considered by DARPA. See the Eligibility Information section of the BAA for more information. |
Additional Information
| Agency Name: | DARPA – Microsystems Technology Office |
| Description: | Amendment 01 – The purpose of this amendment is to extend the FAQ Submission Deadline and Full Proposal Due Date.
The NGMM program will establish a domestic center for R&D and manufacturing 3DHI (three-dimensional heterogeneous integration) microsystems through a subsequent Program Solicitation. The NGMM program will consist of three phases. Phase 0 research for this program (solicited through this HR001122S0050 BAA) will inform planning for the 3DHI manufacturing center by defining exemplar 3DHI microsystems and identifying the equipment, process, and facility requirements for manufacturing these microsystems. The NGMM program plans to establish the 3DHI manufacturing center through a separate, future solicitation. |
| Link to Additional Information: | SAM.gov Contract Opportunities |
| Grantor Contact Information: | If you have difficulty accessing the full announcement electronically, please contact:
BAA Coordinator
HR001122S0050@darpa.mil Email:HR001122S0050@darpa.mil |
DISPLAYING: Synopsis 1
General Information
| Document Type: | Grants Notice |
| Funding Opportunity Number: | HR001122S0050 |
| Funding Opportunity Title: | Next-Generation Microelectronics Manufacturing (NGMM) |
| Opportunity Category: | Discretionary |
| Opportunity Category Explanation: | – |
| Funding Instrument Type: | Cooperative Agreement Grant Other Procurement Contract |
| Category of Funding Activity: | Science and Technology and other Research and Development |
| Category Explanation: | – |
| Expected Number of Awards: | – |
| Assistance Listings: | 12.910 — Research and Technology Development |
| Cost Sharing or Matching Requirement: | No |
| Version: | Synopsis 1 |
| Posted Date: | Aug 05, 2022 |
| Last Updated Date: | Aug 05, 2022 |
| Original Closing Date for Applications: | – |
| Current Closing Date for Applications: | Sep 21, 2022 See Full Announcement for details. |
| Archive Date: | Feb 21, 2023 |
| Estimated Total Program Funding: | – |
| Award Ceiling: | – |
| Award Floor: | – |
Eligibility
| Eligible Applicants: | Others (see text field entitled “Additional Information on Eligibility” for clarification) |
| Additional Information on Eligibility: | All responsible sources capable of satisfying the Government’s needs may submit a proposal that shall be considered by DARPA. See the Eligibility Information section of the BAA for more information. |
Additional Information
| Agency Name: | DARPA – Microsystems Technology Office |
| Description: | The NGMM program will establish a domestic center for R&D and manufacturing 3DHI (three-dimensional heterogeneous integration) microsystems through a subsequent Program Solicitation. The NGMM program will consist of three phases. Phase 0 research for this program (solicited through this HR001122S0050 BAA) will inform planning for the 3DHI manufacturing center by defining exemplar 3DHI microsystems and identifying the equipment, process, and facility requirements for manufacturing these microsystems. The NGMM program plans to establish the 3DHI manufacturing center through a separate, future solicitation. |
| Link to Additional Information: | SAM.gov Contract Opportunities |
| Grantor Contact Information: | If you have difficulty accessing the full announcement electronically, please contact:
BAA Coordinator
HR001122S0050@darpa.mil Email:HR001122S0050@darpa.mil |
Related Documents
Folder 342998 Full Announcement-HR001122S0050 -> HR001122S0050_Attachment_4_OT_Certs_Template.pdf
Folder 342998 Full Announcement-HR001122S0050 -> HR001122S0050_Attachment_3_General_MTO_Controlled_Unclassified_Information_Guide__CUIG_.pdf
Folder 342998 Full Announcement-HR001122S0050 -> HR001122S0050_Attachment_1_Cost_Volume_Proposer_Checklist.pdf
Folder 342998 Full Announcement-HR001122S0050 -> HR001122S0050_Attachment_2_Proposal_Summary_Chart_Template.pdf
Folder 342998 Full Announcement-HR001122S0050 -> HR001122S0050.pdf
Folder 342998 Revised Full Announcement-HR001122S0050-Amendment-01 -> HR001122S0050-Amendment-01.pdf
Folder 342998 Revised Full Announcement-HR001122S0050-Amendment-02 -> HR001122S0050-Amendment-02.pdf
Packages
| Agency Contact Information: | BAA Coordinator HR001122S0050@darpa.mil Email: HR001122S0050@darpa.mil |
| Who Can Apply: | Organization Applicants |
| Assistance Listing Number | Competition ID | Competition Title | Opportunity Package ID | Opening Date | Closing Date | Actions |
|---|---|---|---|---|---|---|
| 12.910 | PKG00276300 | Oct 03, 2022 | Oct 12, 2022 | View |
Package 1
Mandatory forms
342998 RR_SF424_5_0-5.0.pdf
342998 AttachmentForm_1_2-1.2.pdf
342998 RR_KeyPersonExpanded_4_0-4.0.pdf
342998 RR_PersonalData_1_2-1.2.pdf
Optional forms
342998 SFLLL_2_0-2.0.pdf
342998 RR_Budget_3_0-3.0.pdf
342998 RR_Budget10_3_0-3.0.pdf
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