The National Science Foundation (NSF) and the Semiconductor Research Corporation (SRC) are offering this grant to support research into failure-resistant electronic systems. Current single-layer reliability techniques are proving inefficient and impractical for future integrated circuits due to increasing miniaturization, faults, variation, and degradation. This grant seeks fundamental new approaches for designing systems that operate correctly despite transient, permanent, or systematic failures. The program emphasizes a system-level, cross-layer approach, integrating digital and analog components and utilizing information across the design stack, including application-level knowledge. This strategy aims to deliver higher reliability with significantly lower power and performance overheads, tolerating errors, aging, and variation more efficiently. Such advances will boost global competitiveness across multiple industries.
Opportunity ID: 166694
General Information
| Document Type: | Grants Notice |
| Funding Opportunity Number: | 12-556 |
| Funding Opportunity Title: | FAILURE-RESISTANT SYSTEMS |
| Opportunity Category: | Discretionary |
| Opportunity Category Explanation: | – |
| Funding Instrument Type: | Grant |
| Category of Funding Activity: | Science and Technology and other Research and Development |
| Category Explanation: | – |
| Expected Number of Awards: | 20 |
| Assistance Listings: | 47.041 — Engineering Grants |
| Cost Sharing or Matching Requirement: | No |
| Version: | Synopsis 1 |
| Posted Date: | Apr 24, 2012 |
| Last Updated Date: | – |
| Original Closing Date for Applications: | Jul 26, 2012 Full Proposal Deadline(s): July 26, 2012 |
| Current Closing Date for Applications: | Jul 26, 2012 Full Proposal Deadline(s): July 26, 2012 |
| Archive Date: | Aug 26, 2012 |
| Estimated Total Program Funding: | $6,000,000 |
| Award Ceiling: | $400,000 |
| Award Floor: | $300,000 |
Eligibility
| Eligible Applicants: | Others (see text field entitled “Additional Information on Eligibility” for clarification) |
| Additional Information on Eligibility: | *Organization Limit: Proposals may only be submitted by the following: -Universities and Colleges – Universities and two- and four-year colleges (including community colleges) accredited in, and having a campus located in the US, acting on behalf of their faculty members. Such organizations also are referred to as academic institutions. |
Additional Information
| Agency Name: | U.S. National Science Foundation |
| Description: | The National Science Foundation (NSF) and the Semiconductor Research Corporation (SRC) have agreed to embark on a new collaborative research program to address compelling research challenges in failure resistant systems that are of paramount importance to industry, academia, and society at large.New approaches in the design of electronic circuits and systems are needed for products and services that continue to operate correctly in the presence of transient, permanent, or systematic failures. From large information processing systems supporting communications and computation, to small embedded systems targeting medical and automotive applications, whole industries are facing the challenge of improving the reliability of systems. Increasing miniaturization and integrated circuit fabrication processes are creating a tension between reliability and efficiency. Higher rates of faults, variation, and degradation due to aging in integrated circuits are forcing systems engineers to assume that devices and circuits may not always perform as designed. More and more, systems are constructed using IP blocks (3rd party Intellectual Property) from different sources, contributing further to unpredictable behavior. ??Thus behavior under adverse conditions may not be fully known in deployed systems. Current techniques for ensuring reliability, such as voltage and clock rate margins, replication, and disk-based check-pointing will not be able to satisfy the competing requirements for future integrated circuits. These techniques typically operate only at one level of the system stack, yet layers from devices to applications all contribute to system reliability. Such single-layer techniques must be used under worst-case assumptions about the other layers in the stack.?? This potentially leads to inefficiencies that will make these techniques impractical in future fabrication processes. A system-level cross-layer approach to reliability, encompassing failure mechanisms of both digital and analog components, has the potential to deliver high reliability with significantly lower power and performance overheads than current single-layer techniques. By distributing reliability across the system design stack, cross-layer approaches can take advantage of the information available at each level, including even application-level knowledge, to efficiently tolerate errors, aging, and variation. This will allow handling of different physical effects at the most efficient stack layer, and can be adapted to varying application needs, operating environments, and changing hardware state. Fundamental new advances in techniques for designing and developing systems resilient to failure could have a significant impact on multiple industries and boost their competitiveness on a global scale, helping to transform market segments and translate research results into practice. |
| Link to Additional Information: | NSF Publication 12-556 |
| Grantor Contact Information: | If you have difficulty accessing the full announcement electronically, please contact:
NSF grants.gov support
grantsgovsupport@nsf.gov Email:grantsgovsupport@nsf.gov |
Version History
| Version | Modification Description | Updated Date |
|---|---|---|
Related Documents
There are no related documents on this grant.
Packages
| Agency Contact Information: | NSF grants.gov support grantsgovsupport@nsf.gov Email: grantsgovsupport@nsf.gov |
| Who Can Apply: | Organization Applicants |
| Assistance Listing Number | Competition ID | Competition Title | Opportunity Package ID | Opening Date | Closing Date | Actions |
|---|---|---|---|---|---|---|
| 47.070 | PKG00122893 | Apr 24, 2012 | Jul 26, 2012 | View |
Package 1
Mandatory forms
166694 RR_SF424_1_2-1.2.pdf
166694 PerformanceSite_1_4-1.4.pdf
166694 RR_OtherProjectInfo_1_3-1.3.pdf
166694 RR_KeyPersonExpanded_1_2-1.2.pdf
166694 RR_PersonalData_1_2-1.2.pdf
166694 RR_Budget-1.1.pdf
166694 NSF_CoverPage_1_3-1.3.pdf
Optional forms
166694 RR_SubawardBudget-1.2.pdf
166694 NSF_DeviationAuthorization-1.1.pdf
166694 NSF_SuggestedReviewers-1.1.pdf
166694 NSF_Registration_1_3-1.3.pdf
Share This Post, Choose Your Platform!
About the Author: osnqt
