The Advanced Technology Grants Department is offering the Minitherms3D program, a grant designed to revolutionize thermal management for three-dimensional heterogeneous integration (3DHI). This program is for pioneering solutions that significantly reduce thermal resistances, both within the 3D stack and external to it. The initiative aims to drastically improve the efficiency of heat dissipation and substantially increase the volumetric heat removal capabilities of 3DHI systems. This grant is for advancing the fundamental understanding and practical application of thermal solutions, crucial for enhancing the performance and reliability of next-generation electronic and computing architectures. Its core purpose is to drive breakthroughs in thermal engineering to meet future demands in high-density electronics.
Opportunity ID: 345519
General Information
| Document Type: | Grants Notice |
| Funding Opportunity Number: | HR001123S0019 |
| Funding Opportunity Title: | Miniature Integrated Thermal Management Systems for 3D Heterogeneous Integration (Minitherms3D) |
| Opportunity Category: | Discretionary |
| Opportunity Category Explanation: | – |
| Funding Instrument Type: | Cooperative Agreement Grant Other Procurement Contract |
| Category of Funding Activity: | Science and Technology and other Research and Development |
| Category Explanation: | – |
| Expected Number of Awards: | – |
| Assistance Listings: | 12.910 — Research and Technology Development |
| Cost Sharing or Matching Requirement: | No |
| Version: | Synopsis 1 |
| Posted Date: | Jan 23, 2023 |
| Last Updated Date: | Jan 23, 2023 |
| Original Closing Date for Applications: | Apr 11, 2023 See Full Announcement for details. |
| Current Closing Date for Applications: | Apr 11, 2023 See Full Announcement for details. |
| Archive Date: | May 11, 2023 |
| Estimated Total Program Funding: | – |
| Award Ceiling: | – |
| Award Floor: | – |
Eligibility
| Eligible Applicants: | Others (see text field entitled “Additional Information on Eligibility” for clarification) |
| Additional Information on Eligibility: | All responsible sources capable of satisfying the Government’s needs may submit a proposal that shall be considered by DARPA. See the Eligibility Information section of the BAA for more information. |
Additional Information
| Agency Name: | DARPA – Microsystems Technology Office |
| Description: | The Minitherms3D program seeks to revolutionize thermal management for three-dimensional heterogeneous integration (3DHI). This program seeks to significantly reduce thermal resistances within the 3D stack and external to the stack of 3DHI systems, while increasing volumetric heat removal. |
| Link to Additional Information: | SAM.gov Contract Opportunities |
| Grantor Contact Information: | If you have difficulty accessing the full announcement electronically, please contact:
BAA Coordinator
HR001123S0019@darpa.mil Email:HR001123S0019@darpa.mil |
Version History
| Version | Modification Description | Updated Date |
|---|---|---|
Related Documents
There are no related documents on this grant.
Packages
| Agency Contact Information: | BAA Coordinator HR001123S0019@darpa.mil Email: HR001123S0019@darpa.mil |
| Who Can Apply: | Organization Applicants |
| Assistance Listing Number | Competition ID | Competition Title | Opportunity Package ID | Opening Date | Closing Date | Actions |
|---|---|---|---|---|---|---|
| 12.910 | PKG00279366 | Jan 23, 2023 | Apr 11, 2023 | View |
Package 1
Mandatory forms
345519 RR_SF424_5_0-5.0.pdf
345519 RR_KeyPersonExpanded_4_0-4.0.pdf
345519 RR_PersonalData_1_2-1.2.pdf
Optional forms
345519 AttachmentForm_1_2-1.2.pdf
345519 RR_OtherProjectInfo_1_4-1.4.pdf
345519 PerformanceSite_4_0-4.0.pdf
345519 SFLLL_2_0-2.0.pdf
345519 Key_Contacts_2_0-2.0.pdf
345519 Project_Abstract_1_2-1.2.pdf
345519 RR_Budget10_3_0-3.0.pdf
345519 RR_SubawardBudget10_30_3_0-3.0.pdf
345519 RR_Budget_3_0-3.0.pdf
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