The U.S. Embassy in Tokyo is offering a grant to conduct a comprehensive survey focusing on the higher education landscape in Japan. The grant aims to gather valuable insights and data to enhance the quality and accessibility of higher education in the country. The closing date for applications is April 15, 2022.
Opportunity ID: 338140
General Information
| Document Type:: | Grants Notice |
| Funding Opportunity Number:: | TOKYO-PAS-FY22-01-04 |
| Funding Opportunity Title:: | U.S. Embassy Tokyo: Survey of Higher Education in Japan |
| Opportunity Category:: | Discretionary |
| Opportunity Category Explanation:: | |
| Funding Instrument Type:: | |
| Category of Funding Activity:: | Education |
| Category Explanation:: | |
| Expected Number of Awards:: | 1 |
| Assistance Listings Number(s):: | 19.040 — Public Diplomacy Programs |
| Cost Sharing or Matching Requirement:: | No |
| Version:: | Synopsis 2 |
| Posted Date:: | Feb 18, 2022 |
| Last Updated Date:: | Feb 17, 2022 |
| Original Closing Date for Applications:: | Apr 15, 2022 |
| Current Closing Date for Applications:: | Apr 15, 2022 |
| Archive Date:: | |
| Estimated Total Program Funding:: | |
| Award Ceiling:: | $50,000 |
| Award Floor:: | $5,000 |
Eligibility
| Eligible Applicants:: | Public and State controlled institutions of higher education |
| Additional Information on Eligibility:: |
Additional Information
| Agency Name:: | U.S. Mission to Japan |
| Description:: | |
| Link to Additional Information:: | |
| Grantor Contact Information:: | If you have difficulty accessing the full announcement electronically, please contact: |
Version History
| Version | Modification Description | Updated Date |
|---|---|---|
| Synopsis 2 | Feb 17, 2022 |
Package Status
Package No: 1