Opportunity ID: 356695

General Information

Document Type: Grants Notice
Funding Opportunity Number: HQ003425NFOEASD02
Funding Opportunity Title: SEMICONDUCTOR SUPPLY CHAIN AND CYBERSECURITY ASSESSMENT
Opportunity Category: Discretionary
Opportunity Category Explanation:
Funding Instrument Type: Cooperative Agreement
Category of Funding Activity: Other (see text field entitled “Explanation of Other Category of Funding Activity” for clarification)
Category Explanation: SEMICONDUCTOR SUPPLY CHAIN AND CYBERSECURITY ASSESSMENT
Expected Number of Awards: 1
Assistance Listings: 12.599 — Congressionally Directed Assistance
Cost Sharing or Matching Requirement: No
Version: Synopsis 1
Posted Date: Oct 11, 2024
Last Updated Date: Oct 11, 2024
Original Closing Date for Applications: Oct 18, 2024
Current Closing Date for Applications: Oct 18, 2024
Archive Date:
Estimated Total Program Funding:
Award Ceiling: $3,000,000
Award Floor: $0

Eligibility

Eligible Applicants: Others (see text field entitled “Additional Information on Eligibility” for clarification)
Additional Information on Eligibility: For the anticipated cooperative agreement, this requirement is to be negotiated exclusively with Cornell University. See (2) of the NFO document for eligibility requirements for sub-awardees or panel members.

Additional Information

Agency Name: Washington Headquarters Services
Description:

In recent years, the semiconductor supply chain has increasingly become a target for both nation-state actors and cybercriminals. This trend is anticipated to persist, underscoring the need for companies in the semiconductor industry to defend against a broad spectrum of sophisticated threats. The semiconductor supply chain is highly intricate, with global distribution of materials, advanced manufacturing equipment, software tools, and other capabilities. Both design and manufacturing processes involve thousands of employees operating across a worldwide network, making even minor disruptions upstream potentially cause significant ripple effects downstream. This complexity presents unique challenges in modeling and addressing cybersecurity threats.

 

Currently, cybersecurity efforts are focused on enhancing enterprise-wide defenses and responding to existing threats. This leaves limited capacity for organizations to anticipate and map emerging cybersecurity risks against their operations systematically. Addressing these issues is critical for the economic and national security of the United States, as well as for maintaining technological leadership. The U.S. government is making unprecedented investments in semiconductors through the CHIPS Act and other policy initiatives. Simultaneously, foreign governments are also heavily investing in their own semiconductor industries and may be seeking to undermine international competitors through cyber operations. 

The 2023 National Cybersecurity Strategy highlights the importance of integrating substantial cybersecurity investments with semiconductor supply chain resilience to safeguard the U.S. digital ecosystem. Forecasting cybersecurity threats specific to the semiconductor industry is urgently needed to protect the significant investments made by private stakeholders and the U.S. government in strengthening U.S. leadership in this critical sector. The Fiscal Year 2024 National Defense Authorization Act (FY24 NDAA) prescribes entering into agreements for the purpose of assessing the feasibility and advisability of improving the cybersecurity of the semiconductor supply chain.

Link to Additional Information:
Grantor Contact Information: If you have difficulty accessing the full announcement electronically, please contact:

Michael J Fanizzo

Grantor
Email:michael.j.fanizzo.civ@mail.mil

Version History

Version Modification Description Updated Date

Folder 356695 Full Announcement-NFO -> H08 Semiconductors NFO.pdf

Packages

Agency Contact Information: Michael J Fanizzo
Grantor
Email: michael.j.fanizzo.civ@mail.mil
Who Can Apply: Organization Applicants

Assistance Listing Number Competition ID Competition Title Opportunity Package ID Opening Date Closing Date Actions
PKG00288096 Oct 11, 2024 Oct 18, 2024 View

Package 1

Mandatory forms

356695 SF424_4_0-4.0.pdf

356695 SF424B-1.1.pdf

356695 SF424A-1.0.pdf

356695 SFLLL_2_0-2.0.pdf

356695 Project_AbstractSummary_2_0-2.0.pdf

356695 ProjectNarrativeAttachments_1_2-1.2.pdf

356695 AttachmentForm_1_2-1.2.pdf

2025-07-13T10:01:02-05:00

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