DARPA is extending the proposal due date for the WIRED program from November 23, 2015, to November 30, 2015, due to technical issues on the DARPA’s BAA Website. The grant aims to develop advanced infrared sensors that are high-performance, low-cost, and can be directly fabricated on silicon-based ROIC substrates at the wafer scale, focusing on SWIR, MWIR, and high-temperature LWIR detectors that measure photocurrent. Proposers who successfully submitted before the original due date are not required to resubmit, but have the option to do so, clearly noting it as a replacement submission. For more details, refer to DARPA-BAA-15-57 document through Amendment No. 01.
Opportunity ID: 278927
General Information
| Document Type: | Grants Notice |
| Funding Opportunity Number: | DARPA-BAA-15-57 |
| Funding Opportunity Title: | Wafer Scale Infrared Detectors (WIRED) |
| Opportunity Category: | Discretionary |
| Opportunity Category Explanation: | – |
| Funding Instrument Type: | Cooperative Agreement Grant Other Procurement Contract |
| Category of Funding Activity: | Science and Technology and other Research and Development |
| Category Explanation: | – |
| Expected Number of Awards: | – |
| Assistance Listings: | 12.910 — Research and Technology Development |
| Cost Sharing or Matching Requirement: | No |
| Version: | Synopsis 2 |
| Posted Date: | Sep 10, 2015 |
| Last Updated Date: | Nov 24, 2015 |
| Original Closing Date for Applications: | Nov 23, 2015 |
| Current Closing Date for Applications: | Nov 30, 2015 |
| Archive Date: | Jun 07, 2016 |
| Estimated Total Program Funding: | – |
| Award Ceiling: | $0 |
| Award Floor: | $0 |
Eligibility
| Eligible Applicants: | Unrestricted (i.e., open to any type of entity above), subject to any clarification in text field entitled “Additional Information on Eligibility” |
| Additional Information on Eligibility: | – |
Additional Information
| Agency Name: | DARPA – Microsystems Technology Office |
| Description: | Amendment No. 01: The purpose of this amendment is to extend the proposal due date from 23 November 2015 to 30 November 2015. The due date is being extended due to issues with DARPA’s BAA (proposal submission) Website experienced by proposers on 23 November 2015 that prevented proposal submissions from being completed. Those proposers who successfully submitted through DARPA’s BAA (proposal submission) Website prior to the original due date are not required to resubmit their proposals as a result of this extension. However, those proposers who did successfully submit through DARPA’s BAA (proposal submission) Website prior to the original due date may, if they choose, resubmit their proposals – but the resubmitted proposal must very clearly note that it is being submitted in place of the initial submission. See the attached DARPA-BAA-15-57 document, through Amendment No. 01, with changes highlighted in yellow.
Original synopsis is below. DARPA is soliciting research proposals to develop novel technologies for infrared sensors. The WIRED program seeks to provide high-performance, low-cost infrared imagers that respond in the short wave infrared (SWIR) and mid wave infrared (MWIR), and that can be fabricated directly on silicon-based readout integrated circuit (ROIC) substrates at the wafer scale. Also of interest are innovative approaches to high temperature long wave infrared (LWIR) detectors that directly measure photocurrent. |
| Link to Additional Information: | MTO Solicitations Page |
| Grantor Contact Information: | If you have difficulty accessing the full announcement electronically, please contact:
Dr. Jay Lewis
Program Manager Email:DARPA-BAA-15-57@darpa.mil |
Version History
| Version | Modification Description | Updated Date |
|---|---|---|
| Amendment No. 01: The purpose of this amendment is to extend the proposal due date from 23 November 2015 to 30 November 2015. The due date is being extended due to issues with DARPA’s BAA (proposal submission) Website experienced by proposers on 23 November 2015 that prevented proposal submissions from being completed. Those proposers who successfully submitted through DARPA’s BAA (proposal submission) Website prior to the original due date are not required to resubmit their proposals as a result of this extension. However, those proposers who did successfully submit through DARPA’s BAA (proposal submission) Website prior to the original due date may, if they choose, resubmit their proposals – but the resubmitted proposal must very clearly note that it is being submitted in place of the initial submission. | Nov 24, 2015 | |
| Nov 24, 2015 |
DISPLAYING: Synopsis 2
General Information
| Document Type: | Grants Notice |
| Funding Opportunity Number: | DARPA-BAA-15-57 |
| Funding Opportunity Title: | Wafer Scale Infrared Detectors (WIRED) |
| Opportunity Category: | Discretionary |
| Opportunity Category Explanation: | – |
| Funding Instrument Type: | Cooperative Agreement Grant Other Procurement Contract |
| Category of Funding Activity: | Science and Technology and other Research and Development |
| Category Explanation: | – |
| Expected Number of Awards: | – |
| Assistance Listings: | 12.910 — Research and Technology Development |
| Cost Sharing or Matching Requirement: | No |
| Version: | Synopsis 2 |
| Posted Date: | Sep 10, 2015 |
| Last Updated Date: | Nov 24, 2015 |
| Original Closing Date for Applications: | Nov 23, 2015 |
| Current Closing Date for Applications: | Nov 30, 2015 |
| Archive Date: | Jun 07, 2016 |
| Estimated Total Program Funding: | – |
| Award Ceiling: | $0 |
| Award Floor: | $0 |
Eligibility
| Eligible Applicants: | Unrestricted (i.e., open to any type of entity above), subject to any clarification in text field entitled “Additional Information on Eligibility” |
| Additional Information on Eligibility: | – |
Additional Information
| Agency Name: | DARPA – Microsystems Technology Office |
| Description: | Amendment No. 01: The purpose of this amendment is to extend the proposal due date from 23 November 2015 to 30 November 2015. The due date is being extended due to issues with DARPA’s BAA (proposal submission) Website experienced by proposers on 23 November 2015 that prevented proposal submissions from being completed. Those proposers who successfully submitted through DARPA’s BAA (proposal submission) Website prior to the original due date are not required to resubmit their proposals as a result of this extension. However, those proposers who did successfully submit through DARPA’s BAA (proposal submission) Website prior to the original due date may, if they choose, resubmit their proposals – but the resubmitted proposal must very clearly note that it is being submitted in place of the initial submission. See the attached DARPA-BAA-15-57 document, through Amendment No. 01, with changes highlighted in yellow.
Original synopsis is below. DARPA is soliciting research proposals to develop novel technologies for infrared sensors. The WIRED program seeks to provide high-performance, low-cost infrared imagers that respond in the short wave infrared (SWIR) and mid wave infrared (MWIR), and that can be fabricated directly on silicon-based readout integrated circuit (ROIC) substrates at the wafer scale. Also of interest are innovative approaches to high temperature long wave infrared (LWIR) detectors that directly measure photocurrent. |
| Link to Additional Information: | MTO Solicitations Page |
| Grantor Contact Information: | If you have difficulty accessing the full announcement electronically, please contact:
Dr. Jay Lewis
Program Manager Email:DARPA-BAA-15-57@darpa.mil |
DISPLAYING: Synopsis 1
General Information
| Document Type: | Grants Notice |
| Funding Opportunity Number: | DARPA-BAA-15-57 |
| Funding Opportunity Title: | Wafer Scale Infrared Detectors (WIRED) |
| Opportunity Category: | Discretionary |
| Opportunity Category Explanation: | – |
| Funding Instrument Type: | Cooperative Agreement Grant Other Procurement Contract |
| Category of Funding Activity: | Science and Technology and other Research and Development |
| Category Explanation: | – |
| Expected Number of Awards: | – |
| Assistance Listings: | 12.910 — Research and Technology Development |
| Cost Sharing or Matching Requirement: | No |
| Version: | Synopsis 1 |
| Posted Date: | Nov 24, 2015 |
| Last Updated Date: | – |
| Original Closing Date for Applications: | – |
| Current Closing Date for Applications: | Nov 23, 2015 |
| Archive Date: | May 31, 2016 |
| Estimated Total Program Funding: | – |
| Award Ceiling: | $0 |
| Award Floor: | $0 |
Eligibility
| Eligible Applicants: | Unrestricted (i.e., open to any type of entity above), subject to any clarification in text field entitled “Additional Information on Eligibility” |
| Additional Information on Eligibility: | – |
Additional Information
| Agency Name: | DARPA – Microsystems Technology Office |
| Description: | DARPA is soliciting research proposals to develop novel technologies for infrared sensors. The WIRED program seeks to provide high-performance, low-cost infrared imagers that respond in the short wave infrared (SWIR) and mid wave infrared (MWIR), and that can be fabricated directly on silicon-based readout integrated circuit (ROIC) substrates at the wafer scale. Also of interest are innovative approaches to high temperature long wave infrared (LWIR) detectors that directly measure photocurrent. |
| Link to Additional Information: | MTO Solicitations Page |
| Grantor Contact Information: | If you have difficulty accessing the full announcement electronically, please contact:
Dr. Jay Lewis
Program Manager Email:DARPA-BAA-15-57@darpa.mil |
Related Documents
Folder 278927 Full Announcement-1 -> darpa-baa-15-57_wired_final for posting_10 sept 2015.pdf
Folder 278927 Full Announcement-1 -> darpa-baa-15-57_attachment 1_proposer checklist.pdf
Folder 278927 Full Announcement-1 -> darpa-baa-15-57_attachment_2_proposal_summary_chart.pdf
Folder 278927 Full Announcement-2 -> darpa-baa-15-57_wired_amendment 1_final for posting_24nov15.pdf
Packages
| Agency Contact Information: | Dr. Jay Lewis Program Manager Email: DARPA-BAA-15-57@darpa.mil |
| Who Can Apply: | Organization Applicants |
| Assistance Listing Number | Competition ID | Competition Title | Opportunity Package ID | Opening Date | Closing Date | Actions |
|---|---|---|---|---|---|---|
| 12.910 | PKG00218517 | Sep 10, 2015 | Nov 30, 2015 | View |
Package 1
Mandatory forms
278927 RR_SF424_2_0-2.0.pdf
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